Patents by Inventor Winfried Deutscher

Winfried Deutscher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for holding disk-shaped objects
    Publication number: 20090309285
    Abstract: A device for holding disk-shaped objects, particularly semiconductor wafers, having at least three contact elements for depositing and/or fixing the disk-shaped object at its outer edge area. The contact elements are designed such that they have an incline facing the object and a supporting surface.
    Type: Application
    Filed: June 4, 2009
    Publication date: December 17, 2009
    Applicant: VISTEC Semiconductor Systems Jena GmbH
    Inventors: Rene Schenck, Thomas Iffland, Winfried Deutscher
  • Apparatus for holding disk-like objects
    Publication number: 20080203636
    Abstract: An apparatus for holding disk-like objects, in particular semiconductor wafers (12), with at least three contacting elements (18) for supporting and/or fixing the disk-like object at its outer edge region (22). It is provided that at least one of the contacting elements (18) is moveable.
    Type: Application
    Filed: February 25, 2008
    Publication date: August 28, 2008
    Applicant: VISTEC Semiconductor Systems Jena GmbH
    Inventors: Rene Schenck, Detlef Wolter, Thomas Iffland, Winfried Deutscher
  • Holding device for wafers
    Patent number: 6918735
    Abstract: The invention relates to a holding device for wafers in an arrangement for wafer inspection, comprising two grippers (11, 12), each of which, in the closed state of the holding device (8), encloses a subsection of the wafer circumference and which are connected to a drive device (27) and, when the latter is driven, the grippers (11, 12) move away from each other for the purpose of opening the holding device (9) and move toward each other for the purpose of closing the holding device (8), and a holding arm (13), on which the two grippers (11, 12) are pivotably mounted. In this case the holding arm (13) is mounted such that it can rotate about an axis (A) which lies substantially in the plane covered by the wafer (W), so that after a rotation through 180° about the axis (A), a wafer (W) held between the grippers (11, 12) has been turned.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: July 19, 2005
    Assignee: Leica Microsystems Jena GmbH
    Inventors: Karsten Urban, Winfried Deutscher, Joachim Wienecke
  • Holding device for wafers
    Publication number: 20030175106
    Abstract: The invention relates to a holding device for wafers in an arrangement for wafer inspection, comprising two grippers (11, 12), each of which, in the closed state of the holding device (8), encloses a subsection of the wafer circumference and which are connected to a drive device (27) and, when the latter is driven, the grippers (11, 12) move away from each other for the purpose of opening the holding device (9) and move toward each other for the purpose of closing the holding device (8), and a holding arm (13), on which the two grippers (11, 12) are pivotably mounted.
    Type: Application
    Filed: February 25, 2003
    Publication date: September 18, 2003
    Inventors: Karsten Urban, Winfried Deutscher, Joachim Wienecke