Patents by Inventor Winfried Krämer

Winfried Krämer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Gold-based ablation electrode and method
    Patent number: 10772680
    Abstract: One aspect relates to an ablation electrode for high-frequency ablation in medical technology, whereby the ablation electrode includes a gold alloy. One aspect relates to a catheter tip for use with a catheter device, including an ablation electrode, as well as a catheter device for high-frequency ablation, including a catheter tip, as well as the use of an ablation electrode, a catheter tip or a catheter device for high-frequency ablation; as well as a process for production of an ablation electrode.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: September 15, 2020
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Christiane Leitold, Thorsten Keller, Lydia Buckow, Christian Hammermeister, Winfried Krämer
  • GOLD-BASED ABLATION ELECTRODE AND METHOD
    Publication number: 20180014881
    Abstract: One aspect relates to an ablation electrode for high-frequency ablation in medical technology, whereby the ablation electrode includes a gold alloy. One aspect relates to a catheter tip for use with a catheter device, including an ablation electrode, as well as a catheter device for high-frequency ablation, including a catheter tip, as well as the use of an ablation electrode, a catheter tip or a catheter device for high-frequency ablation; as well as a process for production of an ablation electrode.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 18, 2018
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Christiane Leitold, Thorsten Keller, Lydia Buckow, Christian Hammermeister, Winfried Krämer
  • Lead-Free Solder with Improved Properties at Temperatures >150°C
    Publication number: 20100084050
    Abstract: Lead-free solders based on an Sn—In—Ag solder alloy contain 88 to 98.5 wt. % Sn, 1 to 10 wt. % In, 0.5 to 3.5 wt. % Ag, 0 to 1 wt. % Cu, and a doping with a crystallization modifier, the crystallization modifier preferably being a maximum of 100 ppm neodymium.
    Type: Application
    Filed: October 5, 2007
    Publication date: April 8, 2010
    Applicant: W.C. HERAEUS GMBH
    Inventors: Winfried Kraemer, Joerg Trodler