Patents by Inventor Winfried Luerbke

Winfried Luerbke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for producing a semiconductor module
    Patent number: 10032743
    Abstract: A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of the bonding device, a bonding connection is produced between the metallization and a first section of the wire. A separating location and a second section of the wire, the second section being spaced apart from the separating location, are defined on the wire. The wire is reshaped in the second section. Before or after reshaping, the wire is severed at the separating location, such that a terminal conductor of the semiconductor module is formed from a part of the wire. The terminal conductor is bonded to the metallization and having a free end at the separating location.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: July 24, 2018
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Winfried Luerbke
  • Method for Producing a Semiconductor Module
    Publication number: 20140370663
    Abstract: A semiconductor module is produced by providing a circuit carrier having a metallization, an electrically conductive wire and a bonding device. With the aid of the bonding device, a bonding connection is produced between the metallization and a first section of the wire. A separating location and a second section of the wire, the second section being spaced apart from the separating location, are defined on the wire. The wire is reshaped in the second section. Before or after reshaping, the wire is severed at the separating location, such that a terminal conductor of the semiconductor module is formed from a part of the wire. The terminal conductor is bonded to the metallization and having a free end at the separating location.
    Type: Application
    Filed: June 5, 2014
    Publication date: December 18, 2014
    Inventors: Reinhold Bayerer, Winfried Luerbke