Abstract: A method includes dispensing ion-conducting particles on a substrate comprising an adhesive to which the ion-conducting particles adhere; overcoating the ion conducting particles with a polymer; removing the substrate and the adhesive from the ion conducting particles; and removing a polymer overburden on the ion conducting particles to form a device that includes: (i) the polymer or a derivative thereof, and (ii) ion-conducting particles. At least a portion of the ion-conducting particles extend through the polymer or its derivative.

Abstract: A method includes dispensing ion-conducting particles on a substrate comprising an adhesive to which the ion-conducting particles adhere; overcoating the ion conducting particles with a polymer; removing the substrate and the adhesive from the ion conducting particles; and removing a polymer overburden on the ion conducting particles to form a device that includes: (i) the polymer or a derivative thereof, and (ii) ion-conducting particles. At least a portion of the ion-conducting particles extend through the polymer or its derivative.

Abstract: A method includes dispensing ion-conducting particles on a substrate comprising an adhesive to which the ion-conducting particles adhere; overcoating the ion conducting particles with a polymer; removing the substrate and the adhesive from the ion conducting particles; and removing a polymer overburden on the ion conducting particles to form a device that includes: (i) the polymer or a derivative thereof, and (ii) ion-conducting particles. At least a portion of the ion-conducting particles extend through the polymer or its derivative.

Abstract: A device includes a membrane that is: (i) impermeable to oxygen, and (ii) insoluble in at least one polar solvent; and ion conducting particles in the membrane. At least some of the particles extend from a first side of the membrane to an opposed second side of the membrane. The thickness of the membrane is 15 ?m to 100 ?m.

Abstract: A method includes dispensing ion-conducting particles on a substrate comprising an adhesive to which the ion-conducting particles adhere; overcoating the ion conducting particles with a polymer; removing the substrate and the adhesive from the ion conducting particles; and removing a polymer overburden on the ion conducting particles to form a device that includes: (i) the polymer or a derivative thereof, and (ii) ion-conducting particles. At least a portion of the ion-conducting particles extend through the polymer or its derivative.

Abstract: A device includes a membrane that is: (i) impermeable to oxygen, and (ii) insoluble in at least one polar solvent; and ion conducting particles in the membrane. At least some of the particles extend from a first side of the membrane to an opposed second side of the membrane. The thickness of the membrane is 15 ?m to 100 ?m.

Abstract: A flexible capacitive coupler assembly includes a flexible dielectric substrate assembly having a front surface and a rear surface, the front surface having thereon a macroscopic metal capacitive pad. A package supports the flexible dielectric substrate. An electrical connection is made to package wiring or leads on the flexible dielectric substrate to establish electrical contact with a computer subsystem.

Abstract: A mechanism that automatically achieves alignment of the communications elements during assembly of a modular computer system, without the need for human intervention. The mechanism comprises an alignment frame provided with bumps and depressions. The bumps in the alignment frames mate with the depressions on adjacent alignment frames. Each depression comprises an entrance opening that is wider than the diameter of the bumps. The diameter of the entrance opening is determined by the expected accuracy of the alignment of subsystems or bricks within the modular electronic system. When it is desired to align the communication elements, the alignment frames are brought into engagement by causing alignment guides to slide past each other, and to guide the bumps in the alignment frames into the depressions in the adjacent alignment frames. The mechanism further comprises a set of springs that force the allow the alignment frames to be retained securely by the communications elements.

Abstract: According to the present invention, there is provided a system for removing heat from server blades densely packaged in a rack of server blades. The system includes a liquid distribution manifold. In addition, the system includes a plurality of cold blades attached to the liquid distribution manifold, wherein liquid is circulated through the liquid distribution manifold and the cold blades. Moreover, the system includes at least one server blade attached to each of the cold blades.

Abstract: A three-dimensional computer infrastructure cooling system is provided. The three-dimensional computer infrastructure cooling system includes at least one compute, storage, or communications brick. In addition, the three-dimensional computer infrastructure cooling system includes at least one coldrail to facilitate the removal of heat from the at least one compute, storage, or communications brick. Also, the three-dimensional computer infrastructure includes a brick-internal carrier within the at least one compute, storage, communications brick, wherein the brick-internal carrier is attached to the at least one coldrail. Moreover, the three-dimensional computer infrastructure includes a power dissipating electronic element within the at-least-one compute, storage, or communications brick, wherein the power dissipating element is attached to the brick-internal carrier.