Abstract: An extendable device for providing radiation occlusion and/or aero-thermal protection is disclosed. In various representative aspects, the present invention generally includes an extendable collar and a flexure configured to provide elastic properties (e.g., to facilitate stowage and/or deployment with respect to conformational disposition of the flexure). The flexure is coupled to a collar and is also coupled to the housing of an optical device.

Abstract: An extendable device for providing radiation occlusion and/or aero-thermal protection is disclosed. In various representative aspects, the present invention generally includes an extendable collar and a flexure configured to provide elastic properties (e.g., to facilitate stowage and/or deployment with respect to conformational disposition of the flexure). The flexure is coupled to a collar and is also coupled to the housing of an optical device.

Abstract: In one embodiment a chamber body enabling semiconductor processing equipment to be at least partially housed in the chamber body, the semiconductor processing equipment being configured to process a substrate using fluids is disclosed. The chamber body being comprised of a base material implemented to form the chamber body, the chamber body defined by at least a bottom surface and wall surfaces that are integrally connected to the bottom surface to enable capture of overflows of fluids during the processing of the substrate over the chamber body. Additionally, the base material is metallic. The chamber body also has a primer coat material disposed over and on the base material. The primer coat material has metallic constituents to define an integrated bond with the base material along with non-metallic constituents. The chamber body further includes a main coat material disposed over and on the primer coat material.

Abstract: A support for a substrate processing chamber comprises a fluid circulating reservoir comprising a channel having serpentine convolutions. A fluid inlet supplies a heat transfer fluid to the fluid circulating reservoir and a fluid outlet discharges the heat transfer fluid. In one version, the channel is doubled over to turn back upon itself.

Abstract: A power supply having a control circuit for controlling an output of the power supply, and a voltage monitor circuit for detecting a voltage at a first location and providing the detected voltage to a second location in the control circuit independent of any difference in ground voltage between the first location and the second location. The control circuit is configured to control the output of the power supply in response to the detected voltage provided by the voltage monitor circuit.

Abstract: A power supply includes at least one current source for providing current and a reference voltage generator for providing a first reference voltage and a second reference voltage. A control circuit selectively couples the current to the power supply output as a function of a monitored voltage, the first reference voltage, and the second reference voltage.

Abstract: A method is disclosed for operating a push-pull converter in an above resonant frequency operating mode, where the above resonant frequency operating mode produces a switching frequency that is higher than the natural operating resonant frequency of the converter circuit. This in turn means that the resonant period is longer than the turn-on period of each of the switches in the primary circuit.

Abstract: Air ventilation cooling systems are described for operation in a portable power device. Each air ventilation system comprises a cord stand in a structure that allows efficient heat dissipation generated from a power module. In a first aspect of the invention, a portable power device with natural convection for heat transfer is disclosed. In a second aspect of the invention, portable power devices with forced convection for heat transfer are disclosed.

Abstract: An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein.

Abstract: A method of fabricating a semiconductor wafer support chuck apparatus having a first sintered layer and a second sintered layer. The method comprising the steps of providing the first sintered layer having a plurality of gas distribution ports and providing the second sintered layer having a plurality of grooves. The first sintered layer is stacked on top of the second sintered layer, where a diffusion bonding layer is disposed between the first sintered layer and the second sintered layer. Thereafter, the stacked first and second sintered layers are resintered such that the diffusion bonding layer joins the first and second sintered layers together to form a semiconductor wafer support apparatus.

Abstract: An apparatus for reducing by-product formation in a semiconductor wafer-processing chamber. In a first embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange. A collar is disposed over the peripheral flange defining a first gap therebetween, and circumscribes the chuck. A heater element is embedded within the collar and adapted for connection to a power source. In a second embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, and a collar having a heater element embedded therein. The collar is disposed over the peripheral flange to define a gap therebetween, and circumscribes the chuck. Moreover, a pedestal having a gas delivery system therein is disposed below the chuck and collar. In a third embodiment, the apparatus comprises a chuck having a chucking electrode and a radially extending peripheral flange, a collar, and a waste ring having a heater element embedded therein.

Abstract: A method of fabricating a semiconductor wafer support chuck apparatus having a first sintered layer and a second sintered layer. The method comprising the steps of providing the first sintered layer having a plurality of gas distribution ports and providing the second sintered layer having a plurality of grooves. The first sintered layer is stacked on top of the second sintered layer, where a diffusion bonding layer is disposed between the first sintered layer and the second sintered layer. Thereafter, the stacked first and second sintered layers are resintered such that the diffusion bonding layer joins the first and second sintered layers together to form a semiconductor wafer support apparatus.