Patents by Inventor Wing-Cheong G. Lai

Wing-Cheong G. Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for titanium nitride deposition using five-and six-coordinate titanium complexes
    Patent number: 5607722
    Abstract: A method is provided for forming films comprising TiN or Ti--Si--N employing the techniques of chemical vapor deposition to decompose a vapor comprising a compound of the formula Ti[N(R.sup.1)(R.sup.2)].sub.x [(R.sup.3)N--C(R.sup.4)(R.sup.5)--C(R.sup.6)(R.sup.7)--N(R.sup.8)(R.sup.9) ].sub.y wherein each of R.sup.1, R.sup.2, R.sup.3, R.sup.8 and R.sup.9 are (C.sub.1 -C.sub.4) alkyl, each of R.sup.4, R.sup.5, R.sup.6, and R.sup.7 are each H or (C.sub.1 -C.sub.4) alkyl and x and y are 1-3; so as to deposit a film comprising titanium on the surface of a substrate.
    Type: Grant
    Filed: February 9, 1996
    Date of Patent: March 4, 1997
    Assignee: Micron Technology, Inc.
    Inventors: Brian A. Vaartstra, Wing-Cheong G. Lai