Patents by Inventor Wing Cheung James Ho

Wing Cheung James Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7654436
    Abstract: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
    Type: Grant
    Filed: September 20, 2007
    Date of Patent: February 2, 2010
    Assignee: ASM Assembly Automation Ltd.
    Inventors: Wing Cheung James Ho, Hon Shing Eddie Law, Kam Hong Kenneth Lam, Wai Lok Ben To
  • Publication number: 20090078743
    Abstract: A wire bonding apparatus and method in which separate first and second positioning tables are provided for mounting electronic devices to be wire bonded, and a bonding tool is provided at a bonding position for bonding the electronic devices. First and second loading/unloading positions are provided for loading electronic devices to or unloading electronic devices from the positioning tables. The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.
    Type: Application
    Filed: September 20, 2007
    Publication date: March 26, 2009
    Inventors: Wing Cheung James HO, Hon Shing Eddie LAW, Kam Hong Kenneth LAM, Wai Lok Ben TO