Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Abstract: An atomization mechanism for cooling a bond head comprises an atomization module and a conduit. In use, the atomization module receives gas and liquid from a gas supply and a liquid supply respectively to form an atomized spray and the conduit conveys the atomized spray from the atomization module to a spray inlet located at the bond head to receive the atomized spray into the bond head for cooling the bond head.

Abstract: A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Abstract: A die bonding apparatus comprising a first inert gas container having a first inert gas concentration, and a second inert gas container having a second inert gas concentration enclosed within the first inert gas container. The second inert gas concentration is higher than the first inert gas concentration. The die bonding apparatus further comprises a bond head located in the second inert gas container for receiving a die for bonding, and a third inert gas container having an inert gas environment that is separate from the first and second inert gas containers and where a substrate is locatable for die bonding. The bond head is operative to move the die between a first position within the second inert container and a second position within the third inert gas container to bond the die onto the substrate located in the third inert gas container.