Patents by Inventor Wing-Jin Wu

Wing-Jin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100248427
    Abstract: A method of handling a thin wafer includes forming a support structure at the edge of a thinned wafer that is encapsulated by a protection layer. The support structure can be an adhesive layer enclosing the protection layer, a dielectric-filled trench embedded in the thinned wafer and surrounding the protection layer, or a housing affixing the edge of the thinned wafer.
    Type: Application
    Filed: March 4, 2010
    Publication date: September 30, 2010
    Inventors: Wing-Jin WU, Ku-Feng YANG, Wen-Chih CHIOU
  • Publication number: 20020037137
    Abstract: The present invention pertains to an integrated surface-emitting optoelectronic module and the method for making the same. The yellow light procedure is performed to define a V-groove width for disposing an optical fiber on a silicon substrate. After dry etching a vertical groove, a dielectric layer is grown on the surface of the silicon substrate to protect the vertical wall, preventing the groove from getting wider due to subsequent wet etching. A 45-degree mirror surface is formed so that an optoelectronic device can be disposed on the mirror surface in the flip chip method. The optoelectronic module employs a complete silicon substrate to assemble a surface-emitting optoelectronic devices and an optical fiber by passive alignment, and therefore can be free from misalignment due to separate assembly.
    Type: Application
    Filed: December 19, 2000
    Publication date: March 28, 2002
    Inventors: Wing-Jin Wu, Yih-Der Guo, Tsung-Hsuan Chiu, Rong-Heng Yuang, Mu-Tao Chu