Abstract: A low-swing receiver includes a sense amplifier including a first transistor having a source connected with a first voltage supply and a gate for receiving a control signal, and a second transistor having a source connected with a second voltage supply, a drain connected to a drain of the first transistor, and a gate coupled to a second control signal via a capacitive element. A switching circuit is operative to selectively couple an input signal supplied to the sense amplifier with the gate of the second transistor as a function of a signal generated at an output of the sense amplifier. The sense amplifier is operative in a first mode to store charge in the capacitive element, and is operative in a second mode to impart a voltage on the gate of the second transistor which is indicative of the charge stored in the capacitive element.

Abstract: An area-efficient gated diode includes a semiconductor layer of a first conductivity type, an active region of a second conductivity type formed in the semiconductor layer proximate an upper surface thereof, and at least one trench electrode extending vertically through the active region and at least partially into the semiconductor layer. A first terminal of the gated diode is connected to the trench electrode, and a second terminal is connected to the active region. The gated diode is operative in one of at least first an second modes as a function of a voltage potential applied between the first and second terminals. The first mode is characterized by the creation of an inversion layer in the semiconductor layer surrounding the trench electrode. The gated diode has a first capacitance in the first mode and a second capacitance in the second mode, the first capacitance being greater than the second capacitance.

Abstract: A sense amplifier for use in sensing a signal in an integrated circuit comprises an amplifier portion and an output portion. The amplifier portion comprises a gated diode having a gate terminal. The output portion comprises an output transistor in signal communication with the gate terminal of the gated diode and having a source terminal. A variable source voltage acts on the source terminal of the output transistor when the sense amplifier is in operation. The variable source voltage is temporarily altered when the sense amplifier is actively sensing the signal in the integrated circuit.

Abstract: A memory cell for use in an integrated circuit comprises a read transistor and a gated diode. The read transistor has a source terminal. The gated diode has a gate terminal in signal communication with the read transistor. A variable source voltage acts on the source terminal of the read transistor when the memory cell is in operation. The variable source voltage is temporarily altered when the memory cell is read. For example, the source voltage may be reduced when the read transistor is implemented using an N-type transistor and increased when the read transistor is implemented using P-type transistor. This acts to impart the memory cell with faster read speed, higher read margin, and lower standby current.

Abstract: An area-efficient gated diode includes a semiconductor layer of a first conductivity type, an active region of a second conductivity type formed in the semiconductor layer proximate an upper surface thereof, and at least one trench electrode extending vertically through the active region and at least partially into the semiconductor layer. A first terminal of the gated diode is connected to the trench electrode, and a second terminal is connected to the active region. The gated diode is operative in one of at least first an second modes as a function of a voltage potential applied between the first and second terminals. The first mode is characterized by the creation of an inversion layer in the semiconductor layer surrounding the trench electrode. The gated diode has a first capacitance in the first mode and a second capacitance in the second mode, the first capacitance being greater than the second capacitance.

Abstract: An area-efficient gated diode includes a semiconductor layer of a first conductivity type, an active region of a second conductivity type formed in the semiconductor layer proximate an upper surface of the semiconductor layer, and at least one trench electrode extending substantially vertically through the active region and at least partially into the semiconductor layer. A first terminal of the gated diode is electrically connected to the trench electrode, and at least a second terminal is electrically connected to the active region. The gated diode is operative in one of at least a first mode and a second mode as a function of a voltage potential applied between the first and second terminals. The first mode is characterized by the creation of an inversion layer in the semiconductor layer substantially surrounding the trench electrode.

Abstract: A family of logic circuits, called gated diode logic circuits, is disclosed wherein small amplitude signals, typically a fraction of the supply voltage, can be sensed and amplified by applying a small amplitude signal to a gate of a gated diode in a sampling mode and changing a voltage of a source of the gated diode in an evaluation mode. One or more isolation devices may be connected between each small amplitude signal and a gate of the gated diode, wherein the isolation device passes the small amplitude signal to the gate of the gated diode in the sampling mode, and isolates the small amplitude signal from the gate in the evaluation mode for amplification and performing fast logic operations (logic functions). The disclosed gated diode logic circuits overcome the Vt variation problem in FETs by detecting and amplifying the small logic signals utilizing gated diodes that have relatively low Vt variation.

Abstract: A new type of static RAM cell is disclosed that is based on a gated diode and its voltage amplification characteristic. The cell combines the advantages of a static RAM, in which data refresh is not needed, and those of gated diode cells, which are scalable to low voltages, have high signal to noise ratio, high signal margin, and tolerance to process variations, to form a single high performance static memory cell. This new cell has independent read and write paths, which allow for separate optimization of the read (R) and write (W) events, and enable dual-port R/W operation. Furthermore, storage node disturbance during the read and write operations are eliminated, which greatly improves cell stability and scalability for future technologies.

Abstract: A current sensing amplifier for detecting a small current difference between a pair of variable resistance loads comprises a first amplifier and a second amplifier. The first amplifier comprises a voltage clamp including first and second outputs, the voltage clamp being coupled to the pair of variable resistance loads and substantially fixing a predetermined voltage across the variable resistance loads, the voltage clamp transferring the measured current difference to the first and second outputs. The first amplifier further includes a differential current source coupled to the first and second outputs. The second amplifier includes first and second inputs and an output, the first and second inputs being coupled to the first and second outputs, respectively, of the first amplifier.

Abstract: A chip architecture standard merges dynamic random access memory (DRAM) macros and logic cores. The standard from merged DRAM and logic design provides the advantages of simplicity, high read and write access rates, lower power dissipation and noise suppression in system-on-chip designs. The architecture depends upon balanced clock distribution for its high performance and low clock skew to the DRAM macros and logic cores. Balanced wirings from output drivers of the control logic to corresponding inputs of the different DRAM macros minimize differences in address and control signal delays. Separated Vdd and Gnd power grids distribute power to the DRAM macros and the logic cores and incorporate decoupling capacitor arrays to provide noise suppression between the DRAM macros and logic and to minimize di/dt power supply fluctuations on chip performance.