Patents by Inventor Wing Lam AU

Wing Lam AU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING ASPER-SILVER ON A LEAD FRAME
    Publication number: 20160204003
    Abstract: A method for plating a lead frame comprises the steps of plating the lead frame with at least one plating layer including silver and forming an asper-silver layer comprising nano-silver formations over the at least one plating layer including silver. The asper-silver layer is particularly beneficial for enhancing the adhesion of plastic molding compound to the lead frame.
    Type: Application
    Filed: January 8, 2015
    Publication date: July 14, 2016
    Inventors: Yiu Fai KWAN, Yu Lung LAM, Chun Ho YAU, Wing Lam AU