Patents by Inventor Wing Y. Leung

Wing Y. Leung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and circuit for communication between a module and a bus controller in a wafer-scale integrated circuit system
    Patent number: 5613077
    Abstract: A fault-tolerant, high-speed wafer scale system comprises a plurality of functional modules, a parallel hierarchical bus which is fault-tolerant to defects in an interconnect network, and one or more bus masters. This bus includes a plurality of bus lines segmented into sections and linked together by programmable bus switches and bus transceivers or repeaters in an interconnect network.
    Type: Grant
    Filed: September 14, 1994
    Date of Patent: March 18, 1997
    Assignee: Monolithic System Technology, Inc.
    Inventors: Wing Y. Leung, Fu-Chieh Hsu
  • Defect tolerant integrated circuit subsystem for communication between a module and a bus controller in a wafer-scale integrated circuit system
    Patent number: 5592632
    Abstract: A fault-tolerant, high-speed wafer scale system comprises a plurality of functional modules, a parallel hierarchical bus which is fault-tolerant to defects in an interconnect network, and one or more bus masters. This bus includes a plurality of bus lines segmented into sections and linked together by programmable bus switches and bus transceivers or repeaters in an interconnect network.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: January 7, 1997
    Assignee: Monolithic System Technology, Inc.
    Inventors: Wing Y. Leung, Fu-Chieh Hsu