Patents by Inventor Wingkeung Mak

Wingkeung Mak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120222885
    Abstract: A transparent conductive (TC) film includes a main transparent conductive layer and a plurality of conductors electrically contacting with the main transparent conductive layer. The conductors are disposed on the surface of the main transparent conductive layer separately from each other. The transparent conductive film of the present invention has numerous separate conductors to collect electrical current which flow in the TC film, thereby reducing the internal resistance of the TC film while keeping the light transmission unchanged. Furthermore, the new conductor layout reduces the risk of the TC film from high current density damages, thereby achieving better reliability.
    Type: Application
    Filed: April 11, 2011
    Publication date: September 6, 2012
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung MAK, Hotong LEE
  • Patent number: 8120856
    Abstract: A method for manufacturing a polymer miniature lens on a substrate with the lens forming pattern, and the liquid polymer is dispensed therein. The lens forming pattern having a periphery area and an interior area, most portion of the periphery area having a property of confining liquid polymer, while the interior area having at least one portion exposing the surface of the substrate; depositing liquid polymer onto the lens forming pattern; and curing the liquid polymer after the liquid polymer reaches equilibrium shape and is confined to the periphery area. The invention also discloses a collimator including the polymer miniature lens.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: February 21, 2012
    Assignee: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu
  • Publication number: 20110198014
    Abstract: The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances.
    Type: Application
    Filed: April 29, 2011
    Publication date: August 18, 2011
    Applicant: SAE Magnetics (H.K.) Ltd
    Inventors: Wingkeung MAK, Tinhoi Siu, Xiaoxi Liu, Gamboa Guillen, Dianjun Gong, Wei Si
  • Publication number: 20110194186
    Abstract: A method for manufacturing a polymer miniature lens on a substrate with the lens forming pattern, and the liquid polymer is dispensed therein. The lens forming pattern having a periphery area and an interior area, most portion of the periphery area having a property of confining liquid polymer, while the interior area having at least one portion exposing the surface of the substrate; depositing liquid polymer onto the lens forming pattern; and curing the liquid polymer after the liquid polymer reaches equilibrium shape and is confined to the periphery area. The invention also discloses a collimator including the polymer miniature lens.
    Type: Application
    Filed: April 21, 2010
    Publication date: August 11, 2011
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu
  • Publication number: 20100200147
    Abstract: The present invention provides an adhesive bonding method including: providing a first component and a second component to be bonded and an adhesive; positioning the adhesive between the first component and the second component with the adhesive contacting with the first component and the second component; providing at least one light concentrator; and providing a light source and making at least partial light beams of the light source pass through the light concentrator and the first component in order, and then irradiate on the adhesive to cure the adhesive so as to bond the first component and the second component. The adhesive bonding method of the instant invention can maintain the alignment precision between the components being bonded so as to optimize products' performances. The invention also provides a plate installing device with a light concentrator, which can be installed by the adhesive bonding method above mentioned.
    Type: Application
    Filed: July 23, 2009
    Publication date: August 12, 2010
    Applicant: SAE Magnetics (H.K.) Ltd.
    Inventors: Wingkeung Mak, Tinhoi Siu, Xiaoxi Liu, Gamboa Guillen, Dianjun Gong, Wei Si