Patents by Inventor Winslow Round

Winslow Round has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES
    Publication number: 20190295968
    Abstract: A package is disclosed. The package includes a carrier that comprises a first conductive layer on a first side and a second conductive layer on a second side opposite the first side. The first conductive layer comprises wire bonding pads. The package also includes a semiconductor die that is flip chip mounted on the first side of the carrier.
    Type: Application
    Filed: August 8, 2018
    Publication date: September 26, 2019
    Inventors: Bilge Bayrakci, Abdullah Celik, Winslow Round, Santosh Anil Kudtarkar, Yusuf Atesal, Turusan Kolcuoglu