Patents by Inventor Winston Chan

Winston Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190269722
    Abstract: The present invention discloses pharmaceutical-grade ferric organic compounds, including ferric citrate, which are soluble over a wider range of pH, and which have a large active surface area. A manufacturing and quality control process for making a pharmaceutical-grade ferric citrate that consistently complies with the established Manufacture Release Specification is also disclosed. The pharmaceutical-grade ferric organic compounds are suitable for treating disorders characterized by elevated serum phosphate levels.
    Type: Application
    Filed: March 13, 2019
    Publication date: September 5, 2019
    Inventors: Keith CHAN, Winston Town, David W.K. Kwok, Nikolay Mintchev Stoynov
  • Patent number: 9710078
    Abstract: A touch panel and a method for fabricating the touch panel are presented. The touch panel includes a panel and a conductive border. A touch circuit is formed on a first side of the panel. A conductive border is formed on a circumference of the first side along the touch circuit. A method for fabricating the touch panel is further presented. The touch circuit of the touch panel is integrated onto the panel, so as to reduce the number of substrates that need to be bonded, thereby avoiding problems caused by substrate bonding and effectively decreasing the overall thickness of the touch panel.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: July 18, 2017
    Assignee: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston Chan
  • Patent number: 9483136
    Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: November 1, 2016
    Assignee: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston Chan
  • Publication number: 20160162090
    Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.
    Type: Application
    Filed: February 9, 2016
    Publication date: June 9, 2016
    Inventor: Winston CHAN
  • Patent number: 9298322
    Abstract: A touch panel and a method for fabricating the same are presented. The method includes the following steps. A glass substrate is strengthened through a chemical method. The glass substrate includes alkali oxide. An indium tin oxide (ITO) layer is formed below the glass substrate. A sensing circuit, a driving circuit, and an interconnection circuit therebetween are formed in the ITO layer.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: March 29, 2016
    Assignee: Winsky Technology Limited
    Inventor: Winston Chan
  • Patent number: 9256094
    Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: February 9, 2016
    Assignee: Winsky Technology Limited
    Inventor: Winston Chan
  • Publication number: 20150253902
    Abstract: A structure for a mutual capacitance touch panel consists of two conducting layers formed on the same side of a non-conducting substrate, insulating gaps within the structure, and insulating blocks formed between the two conducting layers for electrical isolation. This structure relies on the insulating gaps to form a touch function circuit in the first direction, a first auxiliary touch function region on the first conducting layer, a second touch function circuit in the second direction, and a second auxiliary touch function region on the second conducting layer. The insulating blocks are arranged at intersecting points of the first and second conducting touch function circuits that electrically isolate the first and the second conducting circuits. This structure is achieved by using a simple manufacturing process with a high yield but low material consumption thereby allowing a novel touch function structure to be implemented.
    Type: Application
    Filed: February 16, 2015
    Publication date: September 10, 2015
    Inventor: Winston CHAN
  • Publication number: 20150253901
    Abstract: A manufacturing method for a single-sided multi-layer mutual capacitance touch circuit structure uses selective laser processing. The structure that is created includes two conducting layers on the same side of a transparent non-conducting substrate, with isolation substructures providing the required electrical isolation at the cross-over points of the circuits and electrodes on the two conducting layers. By using selective laser processing, the structure is selectively etched and cures any part of any layer in a multi-layer structure without damaging neighboring regions and other layers.
    Type: Application
    Filed: February 16, 2015
    Publication date: September 10, 2015
    Inventor: Winston CHAN
  • Publication number: 20150009433
    Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.
    Type: Application
    Filed: September 22, 2014
    Publication date: January 8, 2015
    Inventor: Winston CHAN
  • Patent number: 8852746
    Abstract: A substrate coating and a method of forming the same are provided. The substrate coating includes a first layer formed on a substrate, in which the composition of the first layer includes at least silicon-rich-carbon, and the amount of silicon is about equal to or greater than the amount of carbon; and a second layer formed on the first layer, in which the composition of the second layer includes at least fluorine doped diamond-like-carbon. The substrate coating not only is easy to clean, has good wearing performance, and provides a smooth surface, but also has better adhesion to prevent peeling off.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: October 7, 2014
    Assignee: Winsky Technology Limited
    Inventors: Kit Ling Ng, Xin Chao Duan, Po Ching Chan, Winston Chan
  • Patent number: 8734912
    Abstract: A method for patterning a substrate is presented, which includes the following steps. A conductive material is jet-printed onto a part of at least one side of the substrate. A surface of the at least one side of the substrate is imprinted with a laser to pattern a first conductive pattern. By using the method, the process can be simplified and substrates of a touch panel can be integrated, so as to achieve an objective of decreasing the overall thickness of an electronic device.
    Type: Grant
    Filed: March 11, 2011
    Date of Patent: May 27, 2014
    Assignee: Winsky Technology Limited
    Inventor: Winston Chan
  • Publication number: 20140016279
    Abstract: The present invention relates to touch panel and a fabrication method thereof. The method for forming touch panel disclosed in the present invention includes: forming a first pattern on a surface of a first substrate having a conductive material; forming a second pattern on a surface of a second substrate; aligning and laminating the first substrate having the first pattern and the second substrate; and cutting the laminated first substrate and second substrate into a plurality of touch panels. The present invention may resolve problems such as the high probability of substrate cracking and the high complexity of alignment of existing method for fabricating touch panel. A simple fabrication procedure may be used to perform alignment, to lamination and cutting, and the yield may be further improved.
    Type: Application
    Filed: February 14, 2013
    Publication date: January 16, 2014
    Applicant: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston CHAN
  • Publication number: 20110273386
    Abstract: A touch panel and a method for fabricating the same are presented. The method includes the following steps. A glass substrate is strengthened through a chemical method. The glass substrate includes alkali oxide. An indium tin oxide (ITO) layer is formed below the glass substrate. A sensing circuit, a driving circuit, and an interconnection circuit therebetween are formed in the ITO layer.
    Type: Application
    Filed: March 11, 2011
    Publication date: November 10, 2011
    Applicant: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston CHAN
  • Publication number: 20110268943
    Abstract: A substrate coating and a method of forming the same are provided. The substrate coating includes a first layer formed on a substrate, in which the composition of the first layer includes at least silicon-rich-carbon, and the amount of silicon is about equal to or greater than the amount of carbon; and a second layer formed on the first layer, in which the composition of the second layer includes at least fluorine doped diamond-like-carbon. The substrate coating not only is easy to clean, has good wearing performance, and provides a smooth surface, but also has better adhesion to prevent peeling off.
    Type: Application
    Filed: March 11, 2011
    Publication date: November 3, 2011
    Applicant: WINSKY TECHNOLOGY LIMITED
    Inventors: Kit Ling NG, Xin Chao DUAN, Po Ching CHAN, Winston CHAN
  • Publication number: 20110236597
    Abstract: A method for patterning a substrate is presented, which includes the following steps. A conductive material is jet-printed onto a part of at least one side of the substrate. A surface of the at least one side of the substrate is imprinted with a laser to pattern a first conductive pattern. By using the method, the process can be simplified and substrates of a touch panel can be integrated, so as to achieve an objective of decreasing the overall thickness of an electronic device.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 29, 2011
    Applicant: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston CHAN
  • Publication number: 20110234520
    Abstract: A touch panel and a method for fabricating the touch panel are presented. The touch panel includes a panel and a conductive border. A touch circuit is formed on a first side of the panel. A conductive border is formed on a circumference of the first side along the touch circuit. A method for fabricating the touch panel is further presented. The touch circuit of the touch panel is integrated onto the panel, so as to reduce the number of substrates that need to be bonded, thereby avoiding problems caused by substrate bonding and effectively decreasing the overall thickness of the touch panel.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 29, 2011
    Applicant: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston CHAN
  • Publication number: 20110234519
    Abstract: A touch panel is presented, which includes a first substrate, a second substrate, and a third substrate. The first substrate includes a first side having a first circuit. The second substrate includes a first side arranged on the first side of the first substrate and a second side having a second circuit. The third substrate is arranged on the second side of the second substrate. Therefore, by using the structure of the touch panel, the substrates of the touch panel can be integrated, so as to achieve the objective of decreasing the overall thickness of an electronic device.
    Type: Application
    Filed: March 11, 2011
    Publication date: September 29, 2011
    Applicant: WINSKY TECHNOLOGY LIMITED
    Inventor: Winston CHAN
  • Publication number: 20070155071
    Abstract: A system and method for preparing a stepped substrate and an apparatus are disclosed. The method comprises depositing photoresist on a stepped substrate, removing a first portion of the photoresist, reflowing the remaining portion of the photoresist; and etching a portion of the reflowed remaining photoresist and a portion of the stepped substrate. The apparatus comprises a deposited photoresist layer on a stepped substrate, wherein a portion of the photoresist is removed, a reflowed portion of the remaining photoresist, an etched portion of the reflowed photoresist, and an etched portion of the stepped substrate.
    Type: Application
    Filed: October 6, 2006
    Publication date: July 5, 2007
    Inventors: Winston Chan, Alfred Ulmer
  • Publication number: 20070147762
    Abstract: A method of coupling a waveguide to a multi-layered active device structure on a substrate is described. The method includes forming a junction area by etching the active device structure to form a sloped etch profile with respect to the substrate, aligning multiple layers of the multi-layered active device structure via an etch stop adjacent the multi-layered active device structure, and depositing the waveguide over the etched active device structure, wherein a sloped active passive junction is formed at the junction area that reduces residual interface reflection in a resulting coupled device. Also described is a method for removing at least one laser layer in a sloped junction region forming passive amorphous silicon waveguides. This includes depositing a SiN layer for use as an etch mask, patterning a photoresist mask, patterning the SiN layer by reactive ion etching, stripping the photoresist mask, and etching the at least one laser layer.
    Type: Application
    Filed: October 6, 2006
    Publication date: June 28, 2007
    Inventors: Martin Kwakernaak, Winston Chan, David Capewell, Hooman Mohseni
  • Publication number: 20070147761
    Abstract: An optical device and a method of forming the same is described. The optical waveguide includes a substrate, an etch-stop layer adjacent to the substrate, a barrier layer adjacent to the etch-stop layer, and an active waveguide having a lower cladding layer adjacent to the barrier layer. Also described is a method of coupling to at least one active waveguide. The method includes etching an active waveguide with a high selectivity towards a crystallographic plane to form a sloped terminice with respect to a substrate upon which the active waveguide is formed, and depositing at least one other waveguide over the etched sloped terminice and at least a portion of the substrate, wherein the at least one other waveguide is photonically coupled to the etched active waveguide to provide photonic interconnectivity for the etched active waveguide.
    Type: Application
    Filed: October 6, 2006
    Publication date: June 28, 2007
    Inventors: Martin Kwakernaak, Winston Chan, Jongjin Kim, Nagendranath Maley, Leslie Herr