Abstract: Aspects of the disclosure provide a circuit, such as an integrated circuit. The circuit includes a first circuit and a second circuit. The second circuit includes a delay circuit configured to cause the second circuit to have substantially matched delay characteristics of the first circuit in response to at least one parameter change of manufacturing, environmental and operational parameters, such as process variation, temperature variation, and supply voltage variation.

Abstract: The present disclosure describes techniques and apparatuses for multiport memory architecture. In some aspects serial data is received from a data port and converted to n-bit-wide words of data. The n-bit-wide words of data are then buffered as a k-word-long block of parallel data into a line of a multiline buffer as a block of k*n bits of data. The block of k*n bits of data is then transmitted to a multiport memory via a write bus effective to write the block of k*n bits of data to the multiport memory.

Abstract: A memory system includes a memory array and a read/write module. The memory array includes bit lines, word lines, and memory cells. Each of the memory cells is located at an intersection of a respective one of the bit lines and a respective one of the word lines. The memory cells include a first memory cell and a second memory cell. The first memory cell is located at the intersection of a first bit line of the bit lines and a first word line of the word lines. The second memory cell is located at the intersection of a second bit line of the bit lines and a second word line of the word lines. The read/write module is configured to concurrently activate the first memory cell and the second memory cell to simultaneously access both the first memory cell and the second memory cell.

Abstract: A system includes a first device, a first storage element, a comparator and a second device. The first device is configured to test memory cells in an array of memory cells to detect defective memory cells. The defective memory cells include a first memory cell and a second memory cell. The first storage element is configured to store a first address of the first memory cell. The comparator is configured to compare a second address of the second memory cell to the first address.

Abstract: A method including: forming a stack of resistive layers; prior to or subsequent to forming the stack of resistive layers, forming a conductive layer; applying a mask layer on the stack of resistive layers or the conductive layer; forming a first spacer on the mask layer; and etching away a first portion of the mask layer using the first spacer as a first mask to provide a remainder. The method further includes: forming a second spacer on the stack of the resistive layers or the conductive layer and the remainder of the mask layer; etching away a second portion of the remainder of the mask layer to form an island; and using the island as a second mask, etching the stack of the resistive layers to form a resistive element of a memory, and etching the conductive layer to form a conductive element of the memory.

Abstract: A memory system includes first memory cells and second memory cells. Each of the first memory cells includes first and second pass gates including NMOS transistors. Each of the second memory cells include first and second pass gates including PMOS transistors. The first memory cells are pre-charged by one polarity of a voltage supply. The second memory cells are pre-charged by an opposite polarity of the voltage supply.

Abstract: A static random access memory (SRAM) cell includes first and second n-channel transistors, first and second p-channel transistors, first and second enable transistors, and first and second pass gates. The first n-channel transistor, the first p-channel transistor, and the first enable transistor are connected in series between first and second reference potentials. The second n-channel transistor, the second p-channel transistor, and the second enable transistor are connected in series between the first and second reference potentials. The first pass gate is configured to selectively connect a first bitline to a first node. The first node is connected to a gate of the first n-channel transistor and a gate of the first p-channel transistor. The second pass gate is configured to selectively connect a second bitline to a second node. The second node is connected to a gate of the second n-channel transistor and a gate of the second p-channel transistor.

Abstract: A memory includes an array of memory cells, a first module and a second module. The first module is configured to compare a first state of a memory cell with a reference. The memory cell is in the array of memory cells. The second module is configured to, subsequent to a read cycle or a write cycle of the memory cell and based on the comparison, reform the memory cell to adjust a difference between the first state and a second state of the memory cell.

Abstract: A system including a resistive random access memory cell connected to a word line and a bit line and a pre-charge circuit configured to pre-charge the bit line to a first voltage with the word line being unselected. A driver circuit selects the word line at a first time subsequent to the bit line being charged to the first voltage. A comparator compares a second voltage on the bit line to a third voltage supplied to the comparator and generates an output based on the comparison. A latch latches the output of the comparator and generates a latched output. A pulse generator generates a pulse after a delay subsequent to the first time to clock the latch to latch the output of the comparator and generate the latched output. The latched output indicates a state of the resistive random access memory cell.

Abstract: A cell of a resistive random access memory including a resistive element and an access device. The resistive element includes (i) a first electrode and (ii) a second electrode. The access device is configured to select and deselect the cell. The access device includes (i) a first terminal connected to a first contact and (i) a second terminal connected to a second contact. The second contact is connected to the second electrode of the resistive element via a third contact. The third contact includes (i) a first surface in contact with the second contact and (ii) a second surface in contact with the second electrode. The first surface defines a first surface area, and the second surface defines a second surface area. The first surface area is greater than the second surface area.

Abstract: A system includes a resistive random access memory cell and a driver circuit. The resistive random access memory cell includes a resistive element and a switching element, and has a first terminal connected to a bit line and a second terminal connected to a word line. The driver circuit is configured to apply, in response to selection of the resistive random access memory cell using the word line, a first voltage of a first polarity to the bit line to program the resistive random access memory cell to a first state by causing current to flow through the resistive element in a first direction, and a second voltage of a second polarity to the bit line to program the resistive random access memory cell to a second state by causing current to flow through the resistive element in a second direction.

Abstract: A memory includes a module and a demultiplexer. The module is configured to monitor outputs of sense amplifiers. Each of the outputs of the sense amplifiers is configured to be in a first state or a second state. The module is configured to determine that two or more of the outputs of the sense amplifiers are in a same state. The same state is the first state or the second state. The module is configured to output the state of the two or more outputs of the sense amplifiers. The demultiplexer is configured to provide the state of the two or more outputs of the sense amplifiers to a latch.

Abstract: The present disclosure describes techniques and apparatuses for multiport memory architecture. In some aspects serial data is received from a data port and converted to n-bit-wide words of data. The n-bit-wide words of data are then buffered as a k-word-long block of parallel data into a line of a multiline buffer as a block of k*n bits of data. The block of k*n bits of data is then transmitted to a multiport memory via a write bus effective to write the block of k*n bits of data to the multiport memory.

Abstract: Aspects of the disclosure provide a circuit, such as an integrated circuit. The circuit includes a first circuit and a second circuit. The second circuit includes a delay circuit configured to cause the second circuit to have substantially matched delay characteristics of the first circuit in response to at least one parameter change of manufacturing, environmental and operational parameters, such as process variation, temperature variation, and supply voltage variation.

Abstract: A memory array includes a plurality of sense amplifiers and a first switch module. The plurality of sense amplifiers is connected respectively to a plurality of global bit lines. The plurality of sense amplifiers are configured to read data stored in a first block of memory cells of the memory array. The memory cells in the first block are located at intersections of a plurality of local bit lines and a first plurality of word lines. The first switch module is connected to a first group of the plurality of local bit lines and to a first group of the plurality of global bit lines. The first switch module is configured to selectively connect a subset of the first group of the plurality of local bit lines to the first group of the plurality of global bit lines.

Abstract: Circuits, architectures, a system and methods for memories with multiple power supplies and/or multiple low power modes. The circuit generally includes peripheral circuitry operating at a first voltage, a memory array operating at a second voltage, and translation circuitry configured to receive an input from the peripheral circuitry at the first voltage and provide an output to the memory array at the second voltage, the translation circuitry further configured to prevent leakage during a standard operating mode of the memory.

Abstract: Methods for patterning high-density features are described herein. Embodiments of the present invention provide a method comprising patterning a first subset of a pattern, the first subset configured to form a plurality of lines over the substrate, and patterning a second subset of the pattern, the second subset configured to form a plurality of islands over the substrate, wherein said patterning the first subset and said patterning the second subset comprise at least two separate patterning operations.

Abstract: Circuits, architectures, a system and methods for memories with multiple power supplies and/or multiple low power modes. The circuit generally includes peripheral circuitry operating at a first voltage, a memory array operating at a second voltage, and translation circuitry configured to receive an input from the peripheral circuitry at the first voltage and provide an output to the memory array at the second voltage, the translation circuitry further configured to prevent leakage during a standard operating mode of the memory.

Abstract: A memory array includes a plurality of sense amplifiers and a first switch module. The plurality of sense amplifiers is connected respectively to a plurality of global bit lines. The plurality of sense amplifiers are configured to read data stored in a first block of memory cells of the memory array. The memory cells in the first block are located at intersections of a plurality of local bit lines and a first plurality of word lines. The first switch module is connected to a first group of the plurality of local bit lines and to a first group of the plurality of global bit lines. The first switch module is configured to selectively connect a subset of the first group of the plurality of local bit lines to the first group of the plurality of global bit lines.

Abstract: A memory system includes a plurality of bit lines, a plurality of word lines, a plurality of memory cells, and a read/write module. The bit lines include a first bit line and a second bit line. The word lines include a first word line and a second word line. Each memory cell is located at an intersection of a respective one of the bit lines and a respective one of the word lines. The memory cells include a first memory cell and a second memory cell. The first memory cell is located at the intersection of the first bit line and the first word line. The second memory cell is located at the intersection of the second bit line and the second word line. The read/write module is configured to concurrently activate the first memory cell and the second memory cell for (i) a read operation or (ii) a write operation.