Patents by Inventor Wipul Pemsiri Jayasckara

Wipul Pemsiri Jayasckara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabrication for read head having shaped read sensor-biasing layer junctions using partial milling
    Patent number: 7596854
    Abstract: A method is disclosed for fabricating a read head for a magnetic disk drive having a read head sensor and a hard bias layer, where the read head has a shaped junction between the read head sensor and the hard bias layer. The method includes providing a layered wafer stack to be shaped. A single- or multi-layered photoresist mask having no undercut is deposited upon the layered wafer stack to be shaped. The layered wafer stack is shaped by the output of a milling source, where the shaping includes partial milling to within a partial milling range to form a shaped junction. A hard bias layer is then deposited which is in contact with the shaped junction of the wafer stack.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: October 6, 2009
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Marie-Claire Cyrille, Wipul Pemsiri Jayasckara, Mustafa Michael Pinarbasi