Abstract: An implantable medical device including a can, a feedthrough and an antenna assembly. The can includes a lead connector assembly, electronics, and a metal wall defining a hermetic sealed compartment. The electronics and lead connector assembly are located in the hermetic sealed compartment. The feedthrough extends through the metal wall between the hermetic sealed compartment and exterior the metal wall. The antenna assembly includes an antenna extending along the metal wall in a spaced-apart manner from the metal wall and encased in a dielectric material. The dielectric material occupies a space between the antenna and the metal wall. The antenna is electrically connected to the electronics via an RF conductor of the feedthrough.

Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.

Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.

Abstract: Disclosed herein is an implantable electronic device. In one embodiment, the device has a modular header-feedthru assembly and a housing. The modular header-feedthru assembly has a conductor assembly, a feedthru coupled to the conductor assembly, and a polymer header that is injected molded about the conductor assembly and at least a portion of the feedthru. The housing is welded to the feedthru.

Abstract: Disclosed herein is an implantable electronic device. In one embodiment, the device has a modular header-feedthru assembly and a housing. The modular header-feedthru assembly has a conductor assembly, a feedthru coupled to the conductor assembly, and a polymer header that is injected molded about the conductor assembly and at least a portion of the feedthru. The housing is welded to the feedthru.

Abstract: A header-less implantable medical device, system and method are provided. The device includes an electronics module including circuitry, a battery, a receptacle assembly having an interior chamber and a receptable inlet configured to receive a lead connector assembly. A device housing has a case body that includes side walls and a peripheral edge that defines a single common chamber. The electronics module, battery and receptacle assembly are provided within the single common chamber. A connector opening is provided in the case body and joined to the receptacle inlet to form a passage through the case body into the interior chamber of the receptacle assembly.

Abstract: Methods for manufacturing implantable electronic devices include forming an antenna of the implantable electronic device by delivering an antenna trace within a dielectric antenna body. The antenna trace includes a first trace portion disposed in a first transverse layer and defining a first trace path and a second trace portion disposed in a second transverse layer longitudinally offset from the first transverse layer and defining a second trace path. If projected to be coplanar, the first trace path defines a trace boundary and the second trace path is within the trace boundary.

Abstract: A header-less implantable medical device, system and method are provided. The device includes an electronics module including circuitry, a battery, a receptacle assembly having an interior chamber and a receptable inlet configured to receive a lead connector assembly. A device housing has a case body that includes side walls and a peripheral edge that defines a single common chamber. The electronics module, battery and receptacle assembly are provided within the single common chamber. A connector opening is provided in the case body and joined to the receptacle inlet to form a passage through the case body into the interior chamber of the receptacle assembly.

Abstract: Disclosed herein is an implantable electronic device including a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly includes an antenna including a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly includes one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.

Abstract: An implantable medical device including a can, a feedthrough and an antenna assembly. The can includes a lead connector assembly, electronics, and a metal wall defining a hermetic sealed compartment. The electronics and lead connector assembly are located in the hermetic sealed compartment. The feedthrough extends through the metal wall between the hermetic sealed compartment and exterior the metal wall. The antenna assembly includes an antenna extending along the metal wall in a spaced-apart manner from the metal wall and encased in a dielectric material. The dielectric material occupies a space between the antenna and the metal wall. The antenna is electrically connected to the electronics via an RF conductor of the feedthrough.

Abstract: An implantable medical device including a can, a feedthrough and an antenna assembly. The can includes a lead connector assembly, electronics, and a metal wall defining a hermetic sealed compartment. The electronics and lead connector assembly are located in the hermetic sealed compartment. The feedthrough extends through the metal wall between the hermetic sealed compartment and exterior the metal wall. The antenna assembly includes an antenna extending along the metal wall in a spaced-apart manner from the metal wall and encased in a dielectric material. The dielectric material occupies a space between the antenna and the metal wall. The antenna is electrically connected to the electronics via an RF conductor of the feedthrough.

Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.

Abstract: Methods and devices are provided for implantable medical devices. The device comprises a device housing that has an electronics module, an electrode, an antenna, and a header that has a main body. The main body is formed of a ceramic material that includes side walls, a distal end and a proximal mounting end. The main body has an electrode retention region and an antenna retention platform. The antenna extends along the antenna retention platform. The electrode is provided at the electrode retention region. The mounting end includes electrode and antenna connectors. The main body includes a first plated trace formed through the ceramic material to be electrically coupled to the electronics module in the device housing. Between the antenna and the antenna connector, the main body includes a second plated trace formed through the ceramic material between the electrode and the electrode connector.

Abstract: Disclosed herein is an implantable electronic device including a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly includes an antenna including a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly includes one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.

Abstract: An implantable medical device and method are provided for implant within a patient. The device comprises a case. Radio frequency (RF) communication components are housed within the case. A header is mounted to an exterior surface of the case along an edge of the case. An antenna is coupled to the RF communication components. The antenna has an inverted E shape. The inverted E shaped antenna is within the header. The inverted E shaped antenna includes a conducting arm joined to first, second and third branches that are oriented within the header to extend toward the edge of the case underneath the header. The first branch of the antenna is conductively open and, no more than weakly coupled, with respect to the case. The second branch is located between the first and third branches. The second branch is configured to convey an RF signal feed. The third branch has a shunt to ground connection to the case. The case forms a ground plane for the antenna.

Abstract: Disclosed herein is an implantable electronic device having a housing containing an electrical circuit. The implantable electronic device further includes an antenna assembly coupled to the electrical circuit. The antenna assembly has an antenna with a dielectric antenna body within which an antenna trace is disposed. Portions of the antenna trace are disposed in offset transverse layers in a non-overlapping arrangement, thereby reducing capacitive coupling between the layers of the antenna trace. In certain implementations, the antenna assembly has one or more capacitive features that selectively overlap portions of the antenna trace and facilitate tuning of the antenna.

Abstract: An implantable medical device including a can, a feedthru and an antenna assembly. The can includes a lead connector assembly, electronics, and a metal wall defining a hermetic sealed compartment. The electronics and lead connector assembly are located in the hermetic sealed compartment. The feedthru extends through the metal wall between the hermetic sealed compartment and exterior the metal wall. The antenna assembly includes an antenna extending along the metal wall in a spaced-apart manner from the metal wall and encased in a dielectric material. The dielectric material occupies a space between the antenna and the metal wall. The antenna is electrically connected to the electronics via an RF conductor of the feedthru.

Abstract: Methods and devices are provided for implantable medical devices. The device comprises a device housing that has an electronics module, an electrode, an antenna, and a header that has a main body. The main body is formed of a ceramic material that includes side walls, a distal end and a proximal mounting end. The main body has an electrode retention region and an antenna retention platform. The antenna extends along the antenna retention platform. The electrode is provided at the electrode retention region. The mounting end includes electrode and antenna connectors. The main body includes a first plated trace formed through the ceramic material to be electrically coupled to the electronics module in the device housing. Between the antenna and the antenna connector, the main body includes a second plated trace formed through the ceramic material between the electrode and the electrode connector.

Abstract: An implantable medical device and method are provided for implant within a patient. The device comprises a case. Radio frequency (RF) communication components are housed within the case. A header is mounted to an exterior surface of the case along an edge of the case. An antenna is coupled to the RF communication components. The antenna has an inverted E shape. The inverted E shaped antenna is within the header. The inverted E shaped antenna includes a conducting arm joined to first, second and third branches that are oriented within the header to extend toward the edge of the case underneath the header. The first branch of the antenna is conductively open and, no more than weakly coupled, with respect to the case. The second branch is located between the first and third branches. The second branch is configured to convey an RF signal feed. The third branch has a shunt to ground connection to the case. The case forms a ground plane for the antenna.

Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.