Abstract: A solid state relay module configured to be coupled to an electronics enclosure. The solid state relay module includes a body with a first side and an opposite second side and two cable channels extending from the first side of the body. Each of the two cable channels is sized to receive a heating cable. The solid state module also includes a solid state relay platform defined between the two cable channels, where the solid state relay platform is sized to receive a solid state relay. The solid state relay module further includes a heat sink extending from the second side of the body.

Abstract: A heater assembly with a pre-encapsulated heating element and a method of producing the pre-encapsulated heating element are provided. The heater assembly can include a channel defining an interior space and a pre-encapsulated heating element. The pre-encapsulated heating element can include a resistive heating element having a pre-encapsulated portion that is surrounded by a block of potting compound. The pre-encapsulated portion can be received with the interior space of the channel.