Abstract: This invention relates to coatings for the protection of substrates operating at moderately elevated temperatures, and, more particularly, for the protection of titanium-alloy aircraft and stationary gas turbine components as well as engine components for automotive applications, articles having such coatings and a method for their production.

Abstract: A PVD process for coating substrates, wherein the substrate is pre-treated in the vapor of a pulsed, magnetic field-assisted cathode sputtering operation, and during pre-treatment a magnetic field arrangement of the magnetron cathode type, with a strength of the horizontal component in front of the target of 100 to 1500 Gauss, is used for magnetic field-assistance, and after pre-treatment further coating is effected by means of cathode sputtering and the power density of the pulsed discharge during pre-treatment is greater than 1000 W.cm?2.

Abstract: This invention relates to coatings for the protection of substrates operating at moderately elevated temperatures, and, more particularly, for the protection of titanium-alloy aircraft and stationary gas turbine components as well as engine components for automotive applications, articles having such coatings and a method for their production.

Abstract: A base for a decorative layer is provided comprising a first material capable of forming an anodic oxide and a second capable of forming an interference metal oxide formed on the first material. The material capable of forming an anodic oxide layer may comprise a barrier layer formed on a substrate. A decorative layer is formed by anodic oxidation of the layer comprising a material capable of forming an interference metal oxide to form an oxide layer formed on the material capable of forming an interference metal oxide, wherein the oxide layer is configured to have a thickness suitable to cause interference of incident light.

Abstract: A PVD process for coating substrates, wherein the substrate is pre-treated in the vapour of a pulsed, magnetic field-assisted cathode sputtering operation, and during pre-treatment a magnetic field arrangement of the magnetron cathode type, with a strength of the horizontal component in front of the target of 100 to 1500 Gauss, is used for magnetic field-assistance, and after pre-treatment further coating is effected by means of cathode sputtering and the power density of the pulsed discharge during pre-treatment is greater than 1000 W.cm?2.

Abstract: A method and an apparatus for coating substrates is described in which the layer to be applied is produced by the condensing particles of a plasma generated by a gas discharge which are incident on the substrates. Both an arc discharge vaporization coating process and a cathode sputtering coating process are effected in the same apparatus, and the arc discharge vaporization process is carried out before the cathode sputtering process.

Abstract: A vaporizer is described for use in an apparatus for the coating of substrate under vacuum, the vaporizer comprising a holder and a target plate releasably securable to the holder, with the target plate being acted on at its rear side by a coolant medium which flows through the holder. In order to make rapid interchange of the target plate possible while simultaneously optimizing the cooling, the target plate is fixed to the holder via a clamped connection with intermeshing clamping surfaces.

Abstract: An arc magnetron is described in which an edge magnet arrangement is displaceable in the axial direction relative to a preferably fixedly mounted center pole permanent magnet so that a cathode sputtering process and/or an arc discharge process can be realized in dependence on the relative position of the edge magnet arrangement and the center pole magnet.

Abstract: A process using a multiple-substance alloy having a gold content most preferably in the range of 94 to 98 percent by weight as a target in a cathode sputtering apparatus is disclosed. The alloy further contains non-gold elements of aluminum, copper and preferably an element of the group of Co, Ni, G, Ti, In, Cd, Sn, Fe and Pd.

Abstract: Process and apparatus for coating a tool with a layer of a compound which contains at least one of carbon and nitrogen and at least one of titanium, zirconium, chromium, tungsten, tantalum, vanadium, niobium, hafnium and molybdenum. The apparatus includes a vacuum chamber and a substrate holder for accommodating at least one tool with the substrate holder at a bias of between -40 and -200 V relative to ground. The apparatus includes at least two magnetron sputtering cathodes disposed in mirror symmetry to the substrate holder. The target contains at least one metal selected from the group consisting of T, Zr, Cr, W, Ta, V, Nb, Hf and Mo. The apparatus includes at least one gas source for supplying the vacuum chamber with a noble gas and a reaction gas. The reaction gas contains at least one of nitrogen and a gaseous carbon compound. The apparatus includes at least one anode in the edge region of each target so that the anodes are positioned in mirror symmetry with respect to the target holder.

Abstract: A multiple-substance alloy used as a target in a cathode sputtering apparatus, and having a gold content most preferably in the range of 94-98 percent by weight, is disclosed. The alloy further contains non-gold alloys of aluminum, copper and preferably an element of the group of Co, Ni, Ga, Ti, In, Cd, Sn, Fe and Pd.

Abstract: An underlayer of at least one a carbonitride of titanium, zirconium, hafnium or vanadium or hafnium nitride may be under a surface layer at least containing gold or on a still-undermore decorative article, and preferably both. It has a brilliance approximating that of gold so that, when appropriately color matched to the surface layer, it disguises spots of the surface layer worn away in use of the article. The underlayer and surface layer may be deposited in a cathode vaporization process from corresponding metallic cathode targets in appropriate neutral or reactive atmospheres.

Abstract: A multicomponent alloy for targets employed in the sputter coating of gold layers, said alloy having 35% to 55%, preferably either 50% or 42%, non-aurous alloy components.

Abstract: The invention concerns a method of and apparatus for forming electrically conductive transparent oxide coatings on water-containing substrates by magnetic-field reinforced cathodic atomization of a target hot-pressed from powdered oxide ceramic materials. The coatings formed have electrical conductivity.When the atomization process is carried out using direct-current voltages of between 150 and 600 volts and a power density of 3 to 15 and preferably 5 to 10 watts/cm.sup.2, the degree of pressing of the target is at least 75% of the density of the solid material and the atomization atmosphere is maintained at between 1.times.10.sup.-3 and 5.times.10.sup.-2 mbars with a composition of 2 to 20% oxygen, 40 to 70% hydrogen, and the remainder argon. Based upon the speed of travel of the web, a thickness of coating of between 10 and 100 mm and a specific resistance of between 100 and 10,000 .mu..OMEGA.cm are achieved.

Abstract: The invention concerns an array of cathodes for sputtering apparatus that contains first, a target plate made out of the material to be sputtered, second, a system of magnets with poles of opposite signs positioned behind the target plate so that at least some of the lines of magnetic force emerging from the poles pass through and reenter the target plate, and third, a device that can be adjusted to alter the relative positions of the magnets and the target plate. The array is also set up so that at least some of the magnetic lines of force run from the poles through the target plate and back.The purpose of maintaining largely constant sputtering conditions as the target plate is consumed is achieved in accordance with the invention by moving the adjusting device essentially perpendicular to the largest surface of the target plate.

Abstract: A method is disclosed for producing an electric thin layer circuit comprising at least one capacitor and a conductor path and/or a resistor. The number of masks required for the production of such a thin layer circuit is reduced. First and second layers of tantalum-aluminum alloy where the second layer has a tantalum share lower than the first, are applied on an insulating base. In a first masking and etching technique, areas of the first and second layers are etched off outside the circuit elements. At least the second layer is anodically oxidized and the anodically oxidized surface is covered with a silicon dioxide layer so as to form a two layer dielectric for the capacitor. In a second masking and etching technique, not-required areas of the silicon dioxide layer external to the capacitor are removed. By utilizing the silicon dioxide layer remaining as an etching mask, the not-required areas of the tantalum-aluminum oxide layer and the second tantalum-aluminum layer external to the capacitor are removed.

Abstract: The invention concerns a method of coating shaped parts having a three-dimensional coating surface by the cathodic atomization of target material of a first cathode arrangement. The cathode arrangement comprises a magnetic field generator for the concentration of a first discharge space (plasma cloud) in the zone of the target surface by means of a first magnetic field (plasma trap), which is spatially closed with respect to the target. According to the invention and for the purpose of producing a uniform coating even on parts of complicated shape, it is proposed that, on their side disposed opposite the first cathode arrangement, the shaped parts should be simultaneously subjected to the atomizing action of a second cathode arrangement with the same target material.