Abstract: The invention concerns a connection contact for establishing electrical contact in a circuit board or in a lead frame. The invention proposes to produce the connection contact, with an insertion section having at least two layers and having at least three spring limbs whose spring action follows a star-shaped pattern, by means of a stamping process. The insertion section proposed by the invention improves the mechanical and electrical connection with a (multi-layer) circuit board or a lead frame. The connection contact is inserted without soldering.