Abstract: Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.

Abstract: Method for cutting a planar and/or metal workpiece along a predefined cutting contour using a laser beam and a cutting gas emitted from a nozzle, wherein the laser beam makes a recess in the workpiece so as to form a recess hole (on the cutting contour or at least partly close to the cutting contour. At least two machining parameters are continuously modified during formation of the recess hole, and/or at least one machining parameter is continuously modified on a switch path between the recess hole and an endpoint lying on the cutting contour.

Abstract: Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for determining a deviation between an actual position and a desired position of a laser machining head of a laser machining machine. Implementations include actions of selecting at least two different machining positions of the laser machining head, in which a laser beam emitted by the laser machining head is directed onto a desired position of a workpiece, moving the laser machining head into a first selected machining position and forming a through-opening into the workpiece at or around the desired position by operation of the laser beam, moving the laser machining head into a second selected machining position and detecting radiation generated by an interaction between the laser beam and the workpiece, and determining whether there is a deviation between an actual position of the laser machining head and the desired position based on the detected radiation.

Abstract: A method for cutting off an edge portion of a workpiece includes applying a laser to the workpiece to form multiple individual severing cuts in the edge portion such that the edge portion is cut off from the workpiece, the multiple individual severing cuts being arranged together along the edge portion. Applying the laser to the workpiece to form the multiple individual severing cuts includes, for each individual severing cut, translating a laser cutting head and/or the workpiece relative to one another, and detecting, at an end of each severing cut, an edge of the workpiece, in which the translation of the laser cutting head or the workpiece continues at least until the edge is detected.

Abstract: This disclosure relates to methods and apparatuses for marking a data matrix code in the form of an n*m cell matrix of light and dark cells, which respectively consist of a light or dark s*t pixel matrix, on a workpiece by a laser beam, wherein a laser processing unit directs the laser beam onto the workpiece, scans, pixel row by pixel row, the workpiece region to be marked, respectively with a constant marking speed and alternately in opposite directions, and wherein the light pixels and/or the dark pixels are marked on the workpiece during the scan by temporarily switching on the laser beam, wherein the laser processing unit is guided from an already scanned pixel row along a curve having a diameter of which is at least two times the pixel row spacing, to the next pixel row to be scanned.

Abstract: A method of processing structurally identical workpieces using a numerically controlled workpiece processing apparatus includes processing a first workpiece according to a first desired tool path specified for a tool of the numerically controlled workpiece processing apparatus by closed-loop controlling a working distance between the tool and the workpiece to achieve a defined desired distance, such that when processing the first workpiece, the tool is moved along a distance-controlled actual tool path. The method further includes optimizing the first desired tool path for a second workpiece based on the distance-controlled actual tool path of the first workpiece to provide a second desired tool path and processing the second workpiece according to the second desired tool path.

Abstract: Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.

Abstract: This disclosure relates to methods and apparatuses for marking a data matrix code in the form of an n*m cell matrix of light and dark cells, which respectively consist of a light or dark s*t pixel matrix, on a workpiece by a laser beam, wherein a laser processing unit directs the laser beam onto the workpiece, scans, pixel row by pixel row, the workpiece region to be marked, respectively with a constant marking speed and alternately in opposite directions, and wherein the light pixels and/or the dark pixels are marked on the workpiece during the scan by temporarily switching on the laser beam, wherein the laser processing unit is guided from an already scanned pixel row along a curve having a diameter of which is at least two times the pixel row spacing, to the next pixel row to be scanned.

Abstract: A method of processing structurally identical workpieces using a numerically controlled workpiece processing apparatus includes processing a first workpiece according to a first desired tool path specified for a tool of the numerically controlled workpiece processing apparatus by closed-loop controlling a working distance between the tool and the workpiece to achieve a defined desired distance, such that when processing the first workpiece, the tool is moved along a distance-controlled actual tool path. The method further includes optimizing the first desired tool path for a second workpiece based on the distance-controlled actual tool path of the first workpiece to provide a second desired tool path and processing the second workpiece according to the second desired tool path.

Abstract: A method for cutting off an edge portion of a workpiece includes applying a laser to the workpiece to form multiple individual severing cuts in the edge portion such that the edge portion is cut off from the workpiece, the multiple individual severing cuts being arranged together along the edge portion. Applying the laser to the workpiece to form the multiple individual severing cuts includes, for each individual severing cut, translating a laser cutting head and/or the workpiece relative to one another, and detecting, at an end of each severing cut, an edge of the workpiece, in which the translation of the laser cutting head or the workpiece continues at least until the edge is detected.