Patents by Inventor Wolfgang Bergner

Wolfgang Bergner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11855147
    Abstract: A method for producing a semiconductor component includes: forming a silicon carbide substrate having a body layer formed on a section of a main layer, and a source layer formed on a section of the body layer; forming gate trenches and contact trenches extending through the source layer and the body layer, the gate trenches and contact trenches alternating along a first horizontal direction parallel to a first main surface of the silicon carbide substrate; forming a gate dielectric in the gate trenches; forming a metal structure which includes first sections adjoining the gate dielectric in the gate trenches and second sections in the contact trenches, the second sections adjoining body regions formed from sections of the body layer and source regions formed from sections of the source layer; and removing third sections of the metal structure that connect the first sections to the second sections.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: December 26, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ralf Siemieniec, Wolfgang Bergner
  • Patent number: 11842938
    Abstract: A semiconductor device includes a contact metallization layer that includes aluminum and is arranged on a semiconductor substrate, an inorganic passivation structure arranged on the semiconductor substrate, an organic passivation layer comprising a first part that is arranged on the contact metallization layer, and a second part that is arranged on the inorganic passivation structure, a first layer structure including a first part that is in contact with the contact metallization layer, a second part that is contact with the inorganic passivation structure, and a third part that is disposed on the semiconductor substrate laterally between the inorganic passivation structure and the organic passivation layer.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: December 12, 2023
    Assignee: Infineon Technologies AG
    Inventors: Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse, Jochen Hilsenbeck, Ravi Keshav Joshi, Stefan Kramp, Stefan Krivec, Grzegorz Lupina, Hiroshi Narahashi, Andreas Voerckel, Stefan Woehlert
  • Publication number: 20230395663
    Abstract: A semiconductor component includes: gate structures extending into a silicon carbide body from a first surface and having a width along a first horizontal direction parallel to the first surface that is less than a vertical extent of the gate structures perpendicular to the first surface; contact structures extending into the silicon carbide body from the first surface, the gate and contact structures alternating along the first horizontal direction; shielding regions which, in the silicon carbide body, adjoin a bottom of the contact structures and are spaced apart from the gate structures along the first horizontal direction; and source regions between the first surface and body regions. The body regions form pn junctions with the source regions and include main sections adjoining the gate structures and contact sections adjoining the contact structures. A vertical extent of the contact structures is greater than the vertical extent of the gate structures.
    Type: Application
    Filed: May 15, 2023
    Publication date: December 7, 2023
    Inventors: Thomas Ralf Siemieniec, Wolfgang Bergner
  • Patent number: 11626477
    Abstract: A semiconductor component includes: gate structures extending from a first surface into an SiC semiconductor body; a drift zone of a first conductivity type formed in the SiC semiconductor body; first mesas and second mesas arranged between the gate structures in the SiC semiconductor body; body areas of a second conductivity type arranged in the first mesas and the second mesas, the body areas each adjoining a first side wall of one of the gate structures; first shielding areas of the second conductivity type adjoining a second side wall of one of the gate structures; second shielding areas of the second conductivity type adjoining the body areas in the second mesas; and diode areas of the conductivity type of the drift zone, the diode areas forming Schottky contacts with a load electrode between the first shielding areas and the second shielding areas.
    Type: Grant
    Filed: July 14, 2021
    Date of Patent: April 11, 2023
    Assignee: Infineon Technologies AG
    Inventors: Ralf Siemieniec, Thomas Aichinger, Thomas Basler, Wolfgang Bergner, Rudolf Elpelt, Romain Esteve, Michael Hell, Daniel Kueck, Caspar Leendertz, Dethard Peters, Hans-Joachim Schulze
  • Patent number: 11462611
    Abstract: A semiconductor device includes gate trenches formed in a SiC substrate and extending lengthwise in parallel in a first direction. A trench interval which defines a space between adjacent gate trenches extends in a second direction perpendicular to the first direction. Source regions of a first conductivity type formed in the SiC substrate occupy a first part of the space between adjacent gate trenches. Body regions of a second conductivity type opposite the first conductivity type formed in the SiC substrate and below the source regions occupy a second part of the space between adjacent gate trenches. Body contact regions of the second conductivity type formed in the SiC substrate occupy a third part of the space between adjacent gate trenches. Shielding regions of the second conductivity type formed deeper in the SiC substrate than the body regions adjoin a bottom of at least some of the gate trenches.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: October 4, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Aichinger, Wolfgang Bergner, Paul Ellinghaus, Rudolf Elpelt, Romain Esteve, Florian Grasse, Caspar Leendertz, Shiqin Niu, Dethard Peters, Ralf Siemieniec, Bernd Zippelius
  • Patent number: 11417747
    Abstract: In an example, a transistor device is provided. The transistor device includes a plurality of transistor cells each including a gate electrode and each at least partially integrated in a semiconductor body that includes a wide bandgap semiconductor material. The transistor device includes a gate pad arranged on top of the semiconductor body, and a plurality of gate runners each arranged on top of the semiconductor body and each connected to gate electrodes of at least some of the plurality of transistor cells. Each gate runner of the plurality of gate runners has a longitudinal direction, and at least one of the gate runners includes at least a section in which a resistivity per area increases in the longitudinal direction as a distance to the gate pad along the gate runner increases.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: August 16, 2022
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Thomas Aichinger, Wolfgang Bergner, Ralf Siemieniec, Frank Wolter
  • Publication number: 20220093483
    Abstract: A semiconductor device includes a contact metallization layer that includes aluminum and is arranged on a semiconductor substrate, an inorganic passivation structure arranged on the semiconductor substrate, an organic passivation layer comprising a first part that is arranged on the contact metallization layer, and a second part that is arranged on the inorganic passivation structure, a first layer structure including a first part that is in contact with the contact metallization layer, a second part that is contact with the inorganic passivation structure, and a third part that is disposed on the semiconductor substrate laterally between the inorganic passivation structure and the organic passivation layer.
    Type: Application
    Filed: November 30, 2021
    Publication date: March 24, 2022
    Inventors: Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse, Jochen Hilsenbeck, Ravi Keshav Joshi, Stefan Kramp, Stefan Krivec, Grzegorz Lupina, Hiroshi Narahashi, Andreas Voerckel, Stefan Woehlert
  • Patent number: 11282926
    Abstract: A semiconductor device includes a SiC body having a first semiconductor area of a first conductivity type and a second semiconductor area of a second conductivity type. The first semiconductor area is electrically contacted with a first surface of the SiC body and forms a pn junction with the second semiconductor area. The first and second semiconductor areas are arranged on one another in a vertical direction perpendicular to the first surface. The first semiconductor area has first and second dopant species. An average dopant concentration of the first dopant species in a first part of the first semiconductor area adjoining the first surface is greater than an average dopant concentration of the second dopant species. An average dopant concentration of the second dopant species in a second part of the first semiconductor area adjoining the second semiconductor area is greater than a dopant concentration of the first dopant species.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: March 22, 2022
    Assignee: Infineon Technologies AG
    Inventors: Hans-Joachim Schulze, Wolfgang Bergner, Andre Rainer Stegner
  • Patent number: 11217500
    Abstract: A semiconductor device includes a contact metallization layer arranged on a semiconductor substrate, an inorganic passivation structure arranged on the semiconductor substrate, and an organic passivation layer. The organic passivation layer is located between the contact metallization layer and the inorganic passivation structure, and located vertically closer to the semiconductor substrate than a part of the organic passivation layer located on top of the inorganic passivation structure.
    Type: Grant
    Filed: April 9, 2019
    Date of Patent: January 4, 2022
    Assignee: Infineon Technologies AG
    Inventors: Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse, Jochen Hilsenbeck, Ravi Keshav Joshi, Stefan Kramp, Stefan Krivec, Grzegorz Lupina, Hiroshi Narahashi, Andreas Voerckel, Stefan Woehlert
  • Publication number: 20210343835
    Abstract: A semiconductor component includes: gate structures extending from a first surface into an SiC semiconductor body; a drift zone of a first conductivity type formed in the SiC semiconductor body; first mesas and second mesas arranged between the gate structures in the SiC semiconductor body; body areas of a second conductivity type arranged in the first mesas and the second mesas, the body areas each adjoining a first side wall of one of the gate structures; first shielding areas of the second conductivity type adjoining a second side wall of one of the gate structures; second shielding areas of the second conductivity type adjoining the body areas in the second mesas; and diode areas of the conductivity type of the drift zone, the diode areas forming Schottky contacts with a load electrode between the first shielding areas and the second shielding areas.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Inventors: Ralf Siemieniec, Thomas Aichinger, Thomas Basler, Wolfgang Bergner, Rudolf Elpelt, Romain Esteve, Michael Hell, Daniel Kueck, Caspar Leendertz, Dethard Peters, Hans-Joachim Schulze
  • Patent number: 11133378
    Abstract: A semiconductor device is proposed. A trench gate structure extends from a first surface into a silicon carbide semiconductor body along a vertical direction. A trench contact structure extends from the first surface into the silicon carbide semiconductor body along the vertical direction. A source region of a first conductivity type and a body region of a second conductivity type adjoin a first sidewall of the trench gate structure. A diode region of the second conductivity type adjoins a second sidewall of the trench gate structure opposite to the first sidewall. A shielding region of the second conductivity type adjoins a bottom of the trench contact structure, the shielding region being arranged at a lateral distance to the trench gate structure.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: September 28, 2021
    Assignee: Infineon Technologies AG
    Inventors: Ralf Siemieniec, Wolfgang Bergner
  • Publication number: 20210273054
    Abstract: A method for producing a semiconductor component includes: forming a silicon carbide substrate having a body layer formed on a section of a main layer, and a source layer formed on a section of the body layer; forming gate trenches and contact trenches extending through the source layer and the body layer, the gate trenches and contact trenches alternating along a first horizontal direction parallel to a first main surface of the silicon carbide substrate; forming a gate dielectric in the gate trenches; forming a metal structure which includes first sections adjoining the gate dielectric in the gate trenches and second sections in the contact trenches, the second sections adjoining body regions formed from sections of the body layer and source regions formed from sections of the source layer; and removing third sections of the metal structure that connect the first sections to the second sections.
    Type: Application
    Filed: May 17, 2021
    Publication date: September 2, 2021
    Inventors: Ralf Siemieniec, Wolfgang Bergner
  • Patent number: 11101343
    Abstract: A semiconductor component has a gate structure that extends from a first surface into an SiC semiconductor body. A body area in the SiC semiconductor body adjoins a first side wall of the gate structure. A first shielding area and a second shielding area of the conductivity type of the body area have at least twice as high a level of doping as the body area. A diode area forms a Schottky contact with a load electrode between the first shielding area and the second shielding area.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: August 24, 2021
    Assignee: Infineon Technologies AG
    Inventors: Ralf Siemieniec, Thomas Aichinger, Thomas Basler, Wolfgang Bergner, Rudolf Elpelt, Romain Esteve, Michael Hell, Daniel Kueck, Caspar Leendertz, Dethard Peters, Hans-Joachim Schulze
  • Patent number: 11063142
    Abstract: A semiconductor device includes a silicon carbide body that includes a first section and a second section. The first section is adjacent to the second section. A drift region is formed in the first section and the second section. A lattice defect region is in a portion of the drift region in the second section. A first density of lattice defects, which include interstitials and vacancies in the lattice defect region, is at least double a second density of lattice defects, which include interstitials and vacancies in a portion of the drift region outside the lattice defect region.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: July 13, 2021
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Jens Peter Konrath, Wolfgang Bergner, Christian Hecht, Hans-Joachim Schulze, Andre Rainer Stegner
  • Patent number: 11043560
    Abstract: A semiconductor component includes gate structures extending into a silicon carbide body from a first surface. A width of the gate structures along a first horizontal direction parallel to the first surface is less than a vertical extent of the gate structures perpendicular to the first surface. Contact structures extend into the silicon carbide body from the first surface. The gate structures and the contact structures alternate along the first horizontal direction. Shielding regions in the silicon carbide body adjoin a bottom of the contact structures and are spaced apart from the gate structures along the first horizontal direction. Corresponding methods for producing the semiconductor component are also described.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: June 22, 2021
    Assignee: Infineon Technologies AG
    Inventors: Ralf Siemieniec, Wolfgang Bergner
  • Publication number: 20210118986
    Abstract: A semiconductor device includes gate trenches formed in a SiC substrate and extending lengthwise in parallel in a first direction. A trench interval which defines a space between adjacent gate trenches extends in a second direction perpendicular to the first direction. Source regions of a first conductivity type formed in the SiC substrate occupy a first part of the space between adjacent gate trenches. Body regions of a second conductivity type opposite the first conductivity type formed in the SiC substrate and below the source regions occupy a second part of the space between adjacent gate trenches. Body contact regions of the second conductivity type formed in the SiC substrate occupy a third part of the space between adjacent gate trenches. Shielding regions of the second conductivity type formed deeper in the SiC substrate than the body regions adjoin a bottom of at least some of the gate trenches.
    Type: Application
    Filed: December 4, 2020
    Publication date: April 22, 2021
    Inventors: Thomas Aichinger, Wolfgang Bergner, Paul Ellinghaus, Rudolf Elpelt, Romain Esteve, Florian Grasse, Caspar Leendertz, Shiqin Niu, Dethard Peters, Ralf Siemieniec, Bernd Zippelius
  • Publication number: 20210119006
    Abstract: In an example, a transistor device is provided. The transistor device includes a plurality of transistor cells each including a gate electrode and each at least partially integrated in a semiconductor body that includes a wide bandgap semiconductor material. The transistor device includes a gate pad arranged on top of the semiconductor body, and a plurality of gate runners each arranged on top of the semiconductor body and each connected to gate electrodes of at least some of the plurality of transistor cells. Each gate runner of the plurality of gate runners has a longitudinal direction, and at least one of the gate runners includes at least a section in which a resistivity per area increases in the longitudinal direction as a distance to the gate pad along the gate runner increases.
    Type: Application
    Filed: October 16, 2020
    Publication date: April 22, 2021
    Inventors: Thomas AICHINGER, Wolfgang BERGNER, Ralf SIEMIENIEC, Frank WOLTER
  • Publication number: 20210020740
    Abstract: A semiconductor device is proposed. A trench gate structure extends from a first surface into a silicon carbide semiconductor body along a vertical direction. A trench contact structure extends from the first surface into the silicon carbide semiconductor body along the vertical direction. A source region of a first conductivity type and a body region of a second conductivity type adjoin a first sidewall of the trench gate structure. A diode region of the second conductivity type adjoins a second sidewall of the trench gate structure opposite to the first sidewall. A shielding region of the second conductivity type adjoins a bottom of the trench contact structure, the shielding region being arranged at a lateral distance to the trench gate structure.
    Type: Application
    Filed: July 15, 2020
    Publication date: January 21, 2021
    Inventors: Ralf Siemieniec, Wolfgang Bergner
  • Patent number: 10896952
    Abstract: A semiconductor device includes gate trenches formed in a SiC substrate and extending lengthwise in parallel in a first direction. A trench interval which defines a space between adjacent gate trenches extends in a second direction perpendicular to the first direction. Source regions of a first conductivity type formed in the SiC substrate occupy a first part of the space between adjacent gate trenches. Body regions of a second conductivity type opposite the first conductivity type formed in the SiC substrate and below the source regions occupy a second part of the space between adjacent gate trenches. Body contact regions of the second conductivity type formed in the SiC substrate occupy a third part of the space between adjacent gate trenches. Shielding regions of the second conductivity type formed deeper in the SiC substrate than the body regions adjoin a bottom of at least some of the gate trenches.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: January 19, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thomas Aichinger, Wolfgang Bergner, Paul Ellinghaus, Rudolf Elpelt, Romain Esteve, Florian Grasse, Caspar Leendertz, Shiqin Niu, Dethard Peters, Ralf Siemieniec, Bernd Zippelius
  • Patent number: 10886370
    Abstract: A silicon carbide body includes a drift structure having a first conductivity type, a body region, and a shielding region. The body and shielding regions, of a second conductivity type, are located between the drift structure and a first surface of the silicon carbide body. First and second trench gate stripes extend into the silicon carbide body. The body region is in contact with a first sidewall of the first trench gate stripe. The shielding region is in contact with a second sidewall of the second trench gate stripe. The second sidewall has a first length in a lateral first direction parallel to the first surface. A supplementary region of the first conductivity type contacts one or more interface areas of the second sidewall. The one or more interface areas have a combined second length along the first direction, the second length being at most 40% of the first length.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: January 5, 2021
    Assignee: Infineon Technologies AG
    Inventors: Florian Grasse, Axel Sascha Baier, Wolfgang Bergner, Barbara Englert, Christian Strenger