Patents by Inventor Wolfgang Berroth

Wolfgang Berroth has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sealing arrangement, plate assembly, electrochemical system, and method for producing a sealing arrangement
    Patent number: 11876255
    Abstract: The present disclosure relates to a sealing arrangement, comprising: an elastomeric sealing element, which comprises a foamed material containing microspheres, and a metal layer having a surface structuring, the surface structuring comprising a plurality of depressions, wherein the sealing element is configured as a coating of the metal layer and is arranged at least in some areas on the surface structuring, wherein a concentration of the microspheres in the sealing element, measured perpendicular to the surface of the metal layer, is inhomogeneous. The disclosure additionally relates to a plate assembly, to an electrochemical system, and to a method for producing the sealing arrangement.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: January 16, 2024
    Assignee: REINZ-DICHTUNGS-GMBH
    Inventors: Stephan Wenzel, Wolfgang Berroth, Bernd Gaugler, Kai-Uwe Lemke, Andrè Speidel
  • SEALING ARRANGEMENT, PLATE ASSEMBLY, ELECTROCHEMICAL SYSTEM, AND METHOD FOR PRODUCING A SEALING ARRANGEMENT
    Publication number: 20210351421
    Abstract: The present disclosure relates to a sealing arrangement, comprising: an elastomeric sealing element, which comprises a foamed material containing microspheres, and a metal layer having a surface structuring, the surface structuring comprising a plurality of depressions, wherein the sealing element is configured as a coating of the metal layer and is arranged at least in some areas on the surface structuring, wherein a concentration of the microspheres in the sealing element, measured perpendicular to the surface of the metal layer, is inhomogeneous. The disclosure additionally relates to a plate assembly, to an electrochemical system, and to a method for producing the sealing arrangement.
    Type: Application
    Filed: May 10, 2021
    Publication date: November 11, 2021
    Inventors: Stephan Wenzel, Wolfgang Berroth, Bernd Gaugler, Kai-Uwe Lemke, Andrè Speidel