Patents by Inventor Wolfgang Bittner

Wolfgang Bittner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for chip-scale lasers with low spatial coherence and directional emission
    Patent number: 11616341
    Abstract: Exemplary embodiments of the present disclosure include chip-scale laser sources, such as semiconductor laser sources, that produce directional beams with low spatial coherence. The lasing modes are based on the axial orbit in a stable cavity and have good directionality. To reduce the spatial coherence of emission, the number of transverse lasing modes can be increased by fine-tuning the cavity geometry. Decoherence is reached in as little as several nanoseconds. Such rapid decoherence facilitates applications in ultrafast speckle-free full-field imaging.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: March 28, 2023
    Assignee: Yale University
    Inventors: Hui Cao, Stefan Wolfgang Bittner, Kyungduk Kim
  • Systems and Methods for Chip-Scale Lasers with Low Spatial Coherence and Directional Emission
    Publication number: 20210028602
    Abstract: Exemplary embodiments of the present disclosure include chip-scale laser sources, such as semiconductor laser sources, that produce directional beams with low spatial coherence. The lasing modes are based on the axial orbit in a stable cavity and have good directionality. To reduce the spatial coherence of emission, the number of transverse lasing modes can be increased by fine-tuning the cavity geometry. Decoherence is reached in as little as several nanoseconds. Such rapid decoherence facilitates applications in ultrafast speckle-free full-field imaging.
    Type: Application
    Filed: July 24, 2020
    Publication date: January 28, 2021
    Applicant: Yale University
    Inventors: Hui Cao, Stefan Wolfgang Bittner, Kyungduk Kim
  • Feeder for a punching of embossing apparatus and method of operating the apparatus
    Patent number: 7516952
    Abstract: A feeder is provided for a punching or embossing apparatus. The feeder has a configuration for feeding sheets from a multiplicity of stacks. The stacks are disposed next to one another in the transport direction. In a method for punching or embossing sheets using a punching or embossing apparatus, sheets are fed to the punching or embossing apparatus from stacks disposed next to one another.
    Type: Grant
    Filed: March 16, 2005
    Date of Patent: April 14, 2009
    Assignee: Heidelberger Druckmaschinen AG
    Inventors: Wolfgang Bittner, Gerhard Klaassen, Peter Köpke, Andre Pütz
  • Feeder for a punching of embossing apparatus and method of operating the apparatus
    Publication number: 20050206066
    Abstract: A feeder is provided for a punching or embossing apparatus. The feeder has a configuration for feeding sheets from a multiplicity of stacks. The stacks are disposed next to one another in the transport direction. In a method for punching or embossing sheets using a punching or embossing apparatus, sheets are fed to the punching or embossing apparatus from stacks disposed next to one another.
    Type: Application
    Filed: March 16, 2005
    Publication date: September 22, 2005
    Inventors: Wolfgang Bittner, Gerhard Klaassen, Peter Kopke, Andre Putz