Abstract: An adapter, e.g., for a geared motor, includes an adapter shaft, a clutch part, and a bearing, e.g., a rolling bearing. The adapter part has dogs, e.g., dogs protruding in the axial direction, and the inner ring of the bearing is fitted onto a bearing seat, e.g., a finely machined bearing seat, provided on the adapter shaft. The bearing seat covers, in the axial direction, a first region in which the bearing seat is uninterrupted in the circumferential direction, and a second region in which the bearing seat is interrupted in the circumferential direction, e.g., at multiple points.

Abstract: In a part having a rotationally symmetric region and a machining surface, and a method for manufacturing the part from a blank, the machining surface is finished in a planar manner. The normal direction of the machining surface is oriented parallelly to the axis of symmetry, e.g., an axis of rotation, of the rotationally symmetric region. The part includes an annular groove that extends around in a circumferential direction, e.g., with respect to the axis of symmetry. In a circumferential angular region covered by the machining surface, the annular groove is incomplete, e.g., removed down to the groove base of the annular groove, and in a circumferential angular region not covered by the machining surface, the annular groove is complete, e.g., the machining surface bordering on the annular groove and/or leading into the annular groove.

Abstract: In a part having a rotationally symmetric region and a machining surface, and a method for manufacturing the part from a blank, the machining surface is finished in a planar manner. The normal direction of the machining surface is oriented parallelly to the axis of symmetry, e.g., an axis of rotation, of the rotationally symmetric region. The part includes an annular groove that extends around in a circumferential direction, e.g., with respect to the axis of symmetry. In a circumferential angular region covered by the machining surface, the annular groove is incomplete, e.g., removed down to the groove base of the annular groove, and in a circumferential angular region not covered by the machining surface, the annular groove is complete, e.g., the machining surface bordering on the annular groove and/or leading into the annular groove.

Abstract: An extraction device (110) for extracting at least one ingredient from a biological sample (112) is disclosed, specifically for extracting metabolites from a plant specimen. The extraction device (110) has at least one liquid charger (116) which is adapted to be brought in contact with a first side (122) of the sample (112). The liquid charger (116) is adapted to apply an extraction liquid (128), specifically at least one solvent, to the first side (122) of the sample (112). The extraction device (110) further has at least one sampling device (118) which is adapted to be brought in contact with a second side (124) of the sample (112). The sampling device (118) is adapted to collect sample fluid (126) comprising the extraction liquid (128) and the ingredient.

Abstract: A bulk acoustic wave resonator comprising a substrate, a Bragg reflector, a top and a bottom electrode and a piezoelectric layer with means for suppression of the pass-band ripples in a bulk acoustic wave filter. The means for absorbing or scattering the spurious modes are a roughened rear side of the substrate, an absorbing layer disposed on the rear side of the substrate and/or an absorbing layer disposed on the front side of the substrate.

Abstract: An extraction device (110) for extracting at least one ingredient from a biological sample (112) is disclosed, specifically for extracting metabolites from a plant specimen. The extraction device (110) has at least one liquid charger (116) which is adapted to be brought in contact with a first side (122) of the sample (112). The liquid charger (116) is adapted to apply an extraction liquid (128), specifically at least one solvent, to the first side (122) of the sample (112). The extraction device (110) further has at least one sampling device (118) which is adapted to be brought in contact with a second side (124) of the sample (112). The sampling device (118) is adapted to collect sample fluid (126) comprising the extraction liquid (128) and the ingredient.

Abstract: The integrated capacitor structure comprises a first branch with a first capacitor (60) and a second branch with a second capacitor (70). The second capacitor (70) has a higher capacitance density and a lower breakdown voltage than the first capacitor (60). The first branch has a shorter RC time constant than the second branch, such that a voltage peak will substantially follow the first branch. This first capacitor (60) has a sufficient capacity to store the charge of the voltage peak. In one embodiment, the second capacitor (70) is a stacked capacitor. The structure is suitable for ESD-protection and may, to this end, additionally comprise diodes (21) and resistors (22).

Abstract: The integrated capacitor structure comprises a first branch with a first capacitor (60) and a second branch with a second capacitor (70). The second capacitor (70) has a higher capacitance density and a lower breakdown voltage than the first capacitor (60). The first branch has a shorter RC time constant than the second branch, such that a voltage peak will substantially follow the first branch. This first capacitor (60) has a sufficient capacity to store the charge of the voltage peak. In one embodiment, the second capacitor (70) is a stacked capacitor. The structure is suitable for ESD-protection and may, to this end, additionally comprise diodes (21) and resistors (22).

Abstract: The invention relates to a filter device equipped with at least one bulk acoustic wave resonator, which comprises a resonator unit and a reflection element (2) comprising several layers (6, 7, 8). The layers (6, 7, 8) each comprise a mixture of at least two materials. Within each layer (6, 7, 8), the composition of the mixture varies continuously and periodically relative to the layer thickness.

Abstract: A bulk acoustic wave resonator comprising a substrate (5), a Bragg reflector (4), a top (1) and a bottom (3) electrode and a piezoelectric layer (2) with means for suppression of the pass-band ripples in a bulk acoustic wave filter. The means for absorbing or scattering the spurious modes are a roughened rear side of the substrate (6), an absorbing layer (5) disposed on the rear side of the substrate (6) and/or an absorbing layer (5) disposed on the front side of the substrate.

Abstract: The invention relates to a filter device equipped with at least one bulk acoustic wave resonator, which comprises a resonator unit and a reflection unit. The resonator unit comprises a first (3) and a second electrode (5) together with a textured piezoelectric layer (4) between the first (3) and second (5) electrodes.

Abstract: The invention relates to an electronic device provided with an electronic component which comprises an integrated circuit arrangement which has a semiconducting substrate, active components, and passive components such as capacitors with high and with low capacitance values and/or resistors. The invention further relates to a transmitter, a receiver, an electronic component, a peripheral circuit, a power supply circuit, a filter module, and an integrated circuit arrangement.

Abstract: The invention relates to a filter device equipped with at least one bulk acoustic wave resonator, which comprises a resonator unit and a reflection unit. The resonator unit comprises a first (3) and a second electrode (5) together with a textured piezoelectric layer (4) between the first (3) and second (5) electrodes.

Abstract: The invention relates to an array of ultrasound transducers which each comprise a membrane that is comprised of diamond or diamond-like carbon, a barrier structure, a piezoelectric layer, a first electrode and a second electrode. The barrier structure ensures strong adhesion of the piezoelectric layer to the barrier structure and thus to the device and that the piezoelectric layer only comprises a single phase. In addition, the barrier structure protects the membrane against oxidation/decomposition during the manufacturing process of piezoelectric layer. The invention further relates to an ultrasound transducer.

Abstract: A perovskite-containing composite material comprising a substrate, an intermediate layer of a first titanium-containing perovskite and a covering layer of a second perovskite, both the first and the second perovskites being quaternary or higher-substituted perovskites. This composite material exhibits a single-phase perovskite covering layer and, consequently, can very suitably be used for the manufacture of electronic components and modules comprising integrated passive components. A description is given of a method of manufacturing said composite material.

Abstract: The invention relates to a multiple-component unit in which at least two passive components have been realized one above the other. A multiple-component unit thus comprises at least one resistor and at least one capacitor, or at least two capacitors. This space-saving construction allows for a miniaturization of circuits. A further miniaturization can be achieved in that the multiple-component units are not manufactured as discrete components, but are integrated into ICs.

Abstract: The invention relates to an electronic device provided with an electronic component which comprises an integrated circuit arrangement which has a semiconducting substrate, active components, and passive components such as capacitors with high and with low capacitance values and/or resistors. The invention further relates to a transmitter, a receiver, an electronic component, a peripheral circuit, a power supply circuit, a filter module, and an integrated circuit arrangement.

Abstract: The invention relates to a thin film circuit with component. The thin film circuit comprises a network of capacitors, or a network of capacitors and resistors, or a network of capacitors, resistors and inductances, or a network of capacitors and inductances. Current supply contacts such as, for example, SMD end contacts or bump end contacts render it possible for the thin film circuit to be connected to further components of a circuit or, for example, to be combined with active components through the use of contact surfaces.

Abstract: A component includes a substrate layer (1) of glass or Al.sub.2 O.sub.3, an anti-reaction layer (2) or a levelling layer (2), two electrode layers (3, 5) and a dielectric layer (4) as well as such a capacitor. Manufacture a component which provides for cost-effective, surface-mountable (SMD). The anti-reaction layer (2) on the glass substrate (1) or the levelling layer (2) on the Al.sub.2 O.sub.3 -substrate (1) is made of at least one specific material. An anti-reaction layer or a levelling layer (2) of one of the above-mentioned substances or a combination of several substances, enables a dielectric layer (4) to be provided by means of which a high capacitance value is achieved.

Abstract: A method is described of manufacturing ferroelectric bismuth-titanate layers Bi.sub.4 Ti.sub.3 O.sub.12 on a substrate, A solution containing bismuth and titanium is provided, in a stoichiometric ratio, in the form of a metallo-organic or inorganic compound which is homogeneously mixed in an organic solvent, being brought into contact with the substrate and thermally treated at a temperature in the range from 500.degree. C. to 650.degree. C., thereby forming bismuth-titanate Bi.sub.4 Ti.sub.3 O.sub.12.