Patents by Inventor Wolfgang Dietze

Wolfgang Dietze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Disc support structure and method of producing the same
    Patent number: 3962391
    Abstract: A support structure composed of Si or SiC for supporting semiconductor crystal discs during annealing or doping thereof. A somewhat tube-shaped member having at least one flat side is formed by thermal deposition of a gaseous silicon compound onto a similarly shaped carrier member and the tube-shaped member is then cut and mechanically processed in directions parallel and perpendicular to the axes of the tube to form a support structure having a flat base and upwardly extending curved side walls.
    Type: Grant
    Filed: March 20, 1974
    Date of Patent: June 8, 1976
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Dietze, Richard Mittermeier, Gerhard Steinwagner
  • Method of manufacturing shaped hollow bodies
    Patent number: 3943218
    Abstract: A method of producing shaped hollow semiconductor members, as of silicon or silicon carbide by depositing a select semiconductor material from a gaseous compound onto a heated graphite substrate which is first heat-treated above 1300.degree. C. in a flowing gas atmosphere, preferably a mixture of H.sub.2 and SiHCl.sub.3 so as to modify the surface characteristics of the substrate whereby the deposited semiconductor material does not interact with the substrate so that the substrate may be reused.
    Type: Grant
    Filed: June 14, 1973
    Date of Patent: March 9, 1976
    Assignee: Siemens Aktiengesellschaft
    Inventors: Wolfgang Dietze, Andreas Kasper