Patents by Inventor Wolfgang Eckhard

Wolfgang Eckhard has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the manufacture of a power semiconductor component
    Patent number: 6066542
    Abstract: Component structures of, for example, IGBTs are manufactured on the respective top sides of two substrates, the substrates are thinned proceeding from their respective back sides, and, after polishing, the back sides of the thinned substrates are durably electrically conductively connected to one another by wafer bonding.
    Type: Grant
    Filed: February 1, 1999
    Date of Patent: May 23, 2000
    Assignee: Siemens Aktiengesellschaft
    Inventors: Daniel Reznik, Hans-Joachim Schulze, Wolfgang Eckhard