Patents by Inventor Wolfgang FIEN

Wolfgang FIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11843704
    Abstract: The present application relates to ensuring data consistency between a modular device and an external system. Techniques are described for ensuring data consistency between devices at a control device using configuration signatures. A control device can receive and store a baseline configuration signature for a first modular device. Upon initialization of the first modular device, the control device can receive a current configuration signature from the first modular device. The control device can compare the current configuration signature with the baseline configuration signature and, if a mismatch is found, generate a notification indicating that data subsequently received from the first modular device is of uncertain integrity.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: December 12, 2023
    Assignee: Schneider Electric USA, Inc.
    Inventors: Kevin M. Jefferies, Daniel Martin, Surya Narayana H Govindaraju, Juergen Fiess, Christian Ringwald, Wolfgang Fien
  • Publication number: 20220329440
    Abstract: The present application relates to ensuring data consistency between a modular device and an external system. Techniques are described for ensuring data consistency between devices at a control device using configuration signatures. A control device can receive and store a baseline configuration signature for a first modular device. Upon initialization of the first modular device, the control device can receive a current configuration signature from the first modular device. The control device can compare the current configuration signature with the baseline configuration signature and, if a mismatch is found, generate a notification indicating that data subsequently received from the first modular device is of uncertain integrity.
    Type: Application
    Filed: June 29, 2022
    Publication date: October 13, 2022
    Inventors: Kevin M. JEFFERIES, Daniel MARTIN, Surya Narayana H GOVINDARAJU, Juergen FIESS, Christian RINGWALD, Wolfgang FIEN
  • Patent number: 11405217
    Abstract: The present application relates to ensuring data consistency between a modular device and an external system. Techniques are described for ensuring data consistency between devices at a control device using configuration signatures. A control device can receive and store a baseline configuration signature for a first modular device. Upon initialization of the first modular device, the control device can receive a current configuration signature from the first modular device. The control device can compare the current configuration signature with the baseline configuration signature and, if a mismatch is found, generate a notification indicating that data subsequently received from the first modular device is of uncertain integrity.
    Type: Grant
    Filed: July 2, 2020
    Date of Patent: August 2, 2022
    Assignee: Schneider Electric USA, Inc.
    Inventors: Kevin M. Jefferies, Daniel Martin, Surya Narayana H Govindaraju, Juergen Fiess, Christian Ringwald, Wolfgang Fien
  • Publication number: 20210006409
    Abstract: The present application relates to ensuring data consistency between a modular device and an external system. Techniques are described for ensuring data consistency between devices at a control device using configuration signatures. A control device can receive and store a baseline configuration signature for a first modular device. Upon initialization of the first modular device, the control device can receive a current configuration signature from the first modular device. The control device can compare the current configuration signature with the baseline configuration signature and, if a mismatch is found, generate a notification indicating that data subsequently received from the first modular device is of uncertain integrity.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 7, 2021
    Inventors: Kevin M. JEFFERIES, Daniel MARTIN, Surya Narayana H GOVINDARAJU, Juergen FIESS, Christian RINGWALD, Wolfgang FIEN