Patents by Inventor Wolfgang Hasse

Wolfgang Hasse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Long-term heat treated integrated circuit arrangements and methods for producing the same
    Patent number: 9543199
    Abstract: An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: January 10, 2017
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Oliver Aubel, Wolfgang Hasse, Martina Hommel, Heinrich Koerner
  • Long-term heat treated integrated circuit arrangements and methods for producing the same
    Publication number: 20160049329
    Abstract: An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.
    Type: Application
    Filed: December 23, 2013
    Publication date: February 18, 2016
    Inventors: Oliver Aubel, Wolfgang Hasse, Martina Hommel, Heinrich Koerner
  • Long-term heat-treated integrated circuit arrangements and methods for producing the same
    Patent number: 8643183
    Abstract: An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.
    Type: Grant
    Filed: October 30, 2006
    Date of Patent: February 4, 2014
    Assignee: Infineon Technologies AG
    Inventors: Oliver Aubel, Wolfgang Hasse, Martina Hommel, Heinrich Koerner
  • Long-term heat-treated integrated circuit arrangements and methods for producing the same
    Publication number: 20070105366
    Abstract: An explanation is given of, inter alia, methods in which the barrier material is removed at a via bottom or at a via top area by long-term heat treatment. Concurrently or alternatively, interconnects are coated with barrier material in a simple and uncomplicated manner by means of the long-term heat treatment.
    Type: Application
    Filed: October 30, 2006
    Publication date: May 10, 2007
    Inventors: Oliver Aubel, Wolfgang Hasse, Martina Hommel, Heinrich Koerner