Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.

Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.

Abstract: The present invention relates to a method and a device for drying, in particular for drying painted workpieces (6), which has at least two drying units (2), wherein the individual drying unit is set up to receive a number of painted workpieces, and heating means, which are set up to generate a constant temperature in the drying device (1) and in each of the drying units (2).

Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

Abstract: The invention relates to a probe card assembly comprising a stiffener (1), comprising a PCB (2) disposed in the stiffener (1), and comprising a spider (3) supported by the stiffener and the PCB (2), said spider comprising at least one probe (30) to test a wafer (5). This probe card assembly of the PCB (2) is supported in a loosely decoupled manner in the stiffener (1) to prevent transmission of high thermally-induced warping effects.

Abstract: The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.

Abstract: The invention relates to a probe card assembly comprising a stiffener (1), comprising a PCB (2) disposed in the stiffener (1), and comprising a spider (3) supported by the stiffener and the PCB (2), said spider comprising at least one probe (30) to test a wafer (5). This probe card assembly of the PCB (2) is supported in a loosely decoupled manner in the stiffener (1) to prevent transmission of high thermally-induced warping effects.

Abstract: An integrated circuit comprises a package and having adjacent connection pins on two opposite sides of the package, with every second connection pin being inwardly bent so that the connection pins are offset. The ends of the inwardly bent connection pins and the ends of the outer connection pins each lie on a straight line, where the offset connection pins are bent by different angles out of the plane of the package.

Abstract: A method for testing a chip with a package having connecting pins and mounting the package on a board combines the advantages of a package with inline connecting pins with that of a package with offset connecting pins. The package with inline connecting is inserted into a socket for testing. Before mounting on the board, at least one connecting pin, preferably every second connecting pin, of the package is bent inward by a bending tool to achieve an offset arrangement of the connecting pins. The package is preferably mounted on the board using the bending tool. Since every second connecting pin is not bent inward immediately before insertion of the connecting pins, no subsequent corrective alignment of the offset connecting pins is required.

Abstract: A carrier device for a monolithic integrated circuit has portions for the connection of bonding wires in the form of pedestals that rise above a chip connection area on the carrier device and have steep sides.

Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.

Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.

Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.

Abstract: The invention relates to the fabrication and testing of a chip with a package (2) having connecting pins (1) as well as to mounting the package (2) on a board (5), whereby in order to combine the advantages of a package (2) with inline connecting pins (1) with the advantages of a package (2) with offset connecting pins (11, 12), the package (2) is fabricated with inline connecting pins (1) and inserted into a test socket (3) for testing. Immediately before mounting on the board (5), at least one connecting pin, preferably every second connecting pin (12), of the package (2) is bent inward by a bending tool (6) so as to achieve an offset arrangement of the connecting pins (11, 12). The package (2) is preferably mounted on the board (5) using the bending tool (6). A simple, inexpensively produced test socket (3) is sufficient for the purpose of testing the chip. An inexpensively produced guide brace (4), for example, is suitable as a packaging means.

Abstract: The invention relates to an electronic component (1) including a leadframe (2), composed of a platform (5), and possibly at least one electrical connecting piece (6′, 6″), wherein at least one electronic member (3) is located on the platform (5), and including a housing (4) that encloses the electronic member (3) and the platform (5), wherein at least one support region (7) is provided to support the platform (5) during the fabrication process for the housing (4), and wherein at least a section of the at least one support region (7) projects from the housing (4).

Abstract: In a pressure wave sensor comprising a cylindrical housing having a piezo electric element disposed therein, which is forced by a spring against the front face of the housing, the front face consists of a metal foil and a pressure pad consisting of a soft metal is disposed between the piezo electric element and the metal foil, the spring force being sufficiently large to load the pressure pad beyond its yield limit.

Abstract: A solid fixation product of harmful, water-containing waste materials and cement, which product is highly resistant to leaching by water and salt solutions. The product has a high content of 20 to 50% of waste materials based on the dry weight of the waste in the product and a water content corresponding to a water-to-cement ratio of 0.2 to 0.45. The method according to the invention which permits producing of such products is characterized in that evaporation of the water-containing waste materials and the mixing with the fixation matrix takes place concurrently at temperatures of 100.degree. to 180.degree. C. The resulting solid fixation product is of relatively small volume and, accordingly, requires only relatively little storage space.

Abstract: The invention deals with a method and a circuit for operating a spray gun having a vibrating armature drive which is energized with an electrical a.c. signal. To reduce the liquid which is sprayed per unit of time by the spray gun, a pulse width modulated energizing signal with abruptly rising leading edges is fed to the vibrating armature drive. The circuit includes a control circuit which produces a control signal with abruptly rising leading edges and a controllable switch which electrically couples a supply voltage source and the vibrating armature drive, the control terminal of the switch being connected to the output of the control circuit. The circuit may alternatively have a signal generator which produces a control signal with abruptly rising leading edges and a power amplifier connected to the output of the signal generator, the output of the power amplifier being connected to the vibrating armature drive.