Abstract: An exhaust system, especially for an internal combustion engine in a vehicle, includes at least one sensor carrier unit (20) carried on an exhaust gas-carrying element (14). The sensor carrier unit (20) includes a sensor carrier element (22) fixed to the exhaust gas-carrying element (14). A plurality of sensor pipe connections (24, 26, 28), that are fitted or can be fitted with sensors, are provided on the sensor carrier element (22). The plurality of sensor pipe connections (24, 26, 28) each have at least one respective sensor-mounting/measuring opening (30) formed therein.

Abstract: An exhaust system, especially for an internal combustion engine in a vehicle, includes at least one sensor carrier unit (20) carried on an exhaust gas-carrying element (14). The sensor carrier unit (20) includes a sensor carrier element (22) fixed to the exhaust gas-carrying element (14). A plurality of sensor pipe connections (24, 26, 28), that are fitted or can be fitted with sensors, are provided on the sensor carrier element (22). The plurality of sensor pipe connections (24, 26, 28) each have at least one respective sensor-mounting/measuring opening (30) formed therein.

Abstract: The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film, which extends in a plane of support (11). The film is sucked against the support element (6) and partially under the plane of support by exerting negative pressure. The area of the supporting element is provided with at least one surface section (8) which extends in the plane of support when the detaching process begins, and which can be displaced, once the component (1) is grasped by a suction tool (4), plane-parallel to the plane of support while the negative pressure is maintained. The invention allows to control the detaching process of the film in a controlled movement without damaging or displacing the component.

Abstract: The invention relates to a film (2) which comprises a component (1) to be detached therefrom. Said film is placed in the area of the component on a detaching tool (5) that is provided with at least one supporting element (6) for the film, which extends in a plane of support (11). The film is sucked against the support element (6) and partially under the plane of support by exerting negative pressure. The area of the supporting element is provided with at least one surface section (8) which extends in the plane of support when the detaching process begins, and which can be displaced, once the component (1) is grasped by a suction tool (4), plane-parallel to the plane of support while the negative pressure is maintained. The invention allows to control the detaching process of the film in a controlled movement without damaging or displacing the component.

Abstract: For encapsulating an electronic component, in particular a semiconductor chip the component (3) at a distance is fastened onto a flat substrate (2). For this on the substrate there is deposited an elastomer layer (4, 9) which compensates the differing thermal expansion coefficients between the substrate and the component. A buffer material and/or an adhesive in liquid or pasty form is deposited from a dispenser and the component at room temperature is placed onto the buffer material and/or the adhesive. Before the final curing the buffer material and/or the adhesive is firstly subjected to a precuring. Subsequently the component by way of electrical leads is connected to contact locations on the substrate and lastly there is effected an encasing of all remaining hollow spaces including the electrical leads, with a protective mass.

Abstract: In a thin-film solar cell having at least a p-type layer, an intrinsic layer of amorphous silicon and an n-type layer (p-i-n structure), the intrinsic layer has on the interface with the p-type layer an intrinsic interlayer with lower hydrogen content and greater density than the remaining intrinsic layer. The intrinsic layer is deposited on the p-type layer thermocatalytically by the hot wire method, the temperature of the filament being adjusted for controlling the layer properties, and the temperature of the substrate being less than 300.degree. C. The hot wire method can be conducted with an evacuable chamber in which a tantalum wire subjected to at least one weight is mounted in a meander shape at a distance from the substrate holder.

Abstract: A method of aligning an aircraft fuselage axis with an air or ground targ while maintaining a predetermined flight path, involves turning the fuselage around the yaw axis and the transverse axis relative to the flight path. In performing the fuselage turn a side-slip angle is effected by vertical rudder control and superposed thereon is an oppositely directed roll angle. The actuation of the flight control for the fuselage turn is coupled with the fire control system of the aircraft.