Patents by Inventor Wolfgang Johannes HETZEL

Wolfgang Johannes HETZEL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of attaching semiconductor dies to substrates
    Patent number: 8592258
    Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 kgf, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
    Type: Grant
    Filed: October 20, 2011
    Date of Patent: November 26, 2013
    Assignees: United Test and Assembly Center, Ltd., QIMONDA AG
    Inventors: Denver Paul C. Castillo, Bryan Soon Hua Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong, Soo Pin Chow, Wolfgang Johannes Hetzel, Werner Josef Reiss, Florian Ammer
  • SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
    Publication number: 20120034738
    Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
    Type: Application
    Filed: October 20, 2011
    Publication date: February 9, 2012
    Applicants: QIMONDA AG, UNITED TEST AND ASSEMBLY CENTER, LTD.
    Inventors: Denver Paul C. CASTILLO, Bryan Soon Hua TAN, Rodel MANALAC, Kian Teng ENG, Pang Hup ONG, Soo Pin CHOW, Wolfgang Johannes HETZEL, Werner Josef REISS, Florian AMMER
  • SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES
    Publication number: 20090194871
    Abstract: A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds.
    Type: Application
    Filed: December 24, 2008
    Publication date: August 6, 2009
    Applicant: UTAC - United Test and Assembly Test Center, Ltd.
    Inventors: Denver Paul C. Castillo, Soon Hua Bryan Tan, Rodel Manalac, Kian Teng Eng, Pang Hup Ong, Soo Pin Chow, Wolfgang Johannes Hetzel, Werner Josef Reiss, Florian Ammer
  • COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
    Publication number: 20090008796
    Abstract: Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the first substrate and the first semiconductor chip.
    Type: Application
    Filed: December 27, 2007
    Publication date: January 8, 2009
    Applicants: United Test and Assembly Center Ltd.
    Inventors: Kian Teng Eng, Wolfgang Johannes HETZEL, Werner Josef REISS, Florian AMMER, Yong Chuan KOH, Jimmy SIAT