Abstract: Molding compounds for encapsulating semiconductor components comprise filler-containing polyepoxy resins and a 1,3,5-tris(3-amino-4-alkylphenyl)-2,4,6-trioxohexahydrotriazine with a C.sub.1 to C.sub.4 alkyl radical as a hardener. The molding compounds are storage-stable and moldings manufactured therefrom meet the requirements for these materials.

Abstract: Prepregs can be prepared by impregnating reinforcement materials such as glass, carbon or plastic (in the form of fibers or nonwoven or woven materials) with a solution of a polyepoxy resin and a polyamine as a hardener and subsequent drying. For the manufacture of storage-stable prepregs based on polyepoxy resins, 1,3,5-tris(3-amino-4-alkylphenyl-2,4,6-trioxo-hexahydrotriazine with a C.sub.1 - to C.sub.4 alkyl radical is used as the hardener. The new method leads to storage-stable prepregs and assures that composite materials, especially circuit boards, manufactured therefrom meet the requirements for these materials.

Abstract: Electrically insulating composite materials formed from (1) epoxy resins and (2) polymeric fiber reinforcement which have high strength are formed if the cross-linking of the epoxy resin is accomplished by anionic polymerization using tertiary amines of the formula ##STR1## as catalyst.

Abstract: Glow polymerisate layers can be generated on a substrate, starting from hydrocarbons and/or fluorocarbons, by means of a high-frequency, low-pressure glow discharge. Glow polymerisates completely saturated with hydrogen or fluorine are obtained when the glow discharge is carried out in the microwave range between 0.5 and 1.000 GHz and if the amplitude E.sub.0 of the effective field strength in the vicinity of the substrate no greater than 850 V/cm.

Abstract: Improved printed circuit boards of laminated thermosetting sheets with epoxy resin as the bonding agent contain for inhibiting copper migration 0.1% to 10% N,N'-bis-salicyloyl hydrazine, based on the weight of the hardened epoxy resin.

Abstract: The invention relates to a method for the preparation of thin polyimide layers by applying a solution of a polyimide prepolymer to a substrate, and subsequently annealing, and has as its object the provision of a method of this type in such a way that the preparation of layers with layer thicknesses of .ltoreq.0.2 .mu.m is made possible which layers have a homogeneous character and exhibit good adhesion. For this purpose, the invention provides that film-forming prepolymers of highly heat-resistant polyimides are used which prepolymers give off a high percentage of volatile products in annealing. The method according to the invention is particularly suitable for the production of orientation layers for liquid-crystal displays.

Abstract: This application relates to methods for the manufacture of leakage current-proof epoxy-resin molded materials from epoxy resin mixture based on di- or polycarboxylic-acid glycidyl esters, di- or polyfunctional cycloaliphatic olefinic epoxides and dicarboxylic-acid anhydrides, carried out in such a manner that molded materials with good mechanical properties are obtained also for parts of large volume. For this purpose, the invention provides that, by means of the experimentally determined time necessary to reach the maximum temperature during the cross-linking of the epoxy resin mixture under quasi adiabatic conditions, the rate of cross-linking of the epoxy resin mixture is adjusted, by the addition of a diol or polyol, to at least as long as the time necessary to reach the maximum temperature during cross-linking of the glycidyl ester/dicarboxylic acid anhydride components.

Abstract: Molding materials, laminates, stratified material and cover or protective layers which are of high electrical and mechanical quality are formed from polymerisable epoxy compounds if the corss-linking of the epoxy resins is accomplished by anionic polymerisation, using mixed catalysts of tertiary amines of the formula: ##STR1## and an imidazoles of the formula: ##STR2## as a polymerisation catalysts.

Abstract: The invention relates to a method for cross-linking radically cross-linkable polymers and for stabilizing such polymers against oxidative and/or thermal decomposition. The method is developed so that rapid and economical cross-linking of radically cross-linkable polymers is obtained in the presence of oxidation inhibitors without adverse effects on the cross-linking process due to the oxidation inhibitor. For this purpose, the invention provides that the cross-linking is carried out in the presence of oxidation inhibitors, wherein the inhibition-active --OH and/or --NH functions are at least partially substituted by protective silyl- and/or silylene groups, the inhibitor molecule containing at least one Si-alkenyl group. The method according to the invention is suitable for use with radical as well as radiation-cross-linkable polymer.

Abstract: Addition complexes of tertiary amines and boron trichloride of the general formula BCl.sub.3.NR.sub. 1 R.sub.2 R.sub. 3 are used as an accelerator system for a heat-curing reaction resin mixture of purified polyisocyanate and polyepoxy resin compounds. Insulation impregnated with this reaction resin mixture exhibits high thermal stability in the hardened condition and can be used at high operating temperatures.

Abstract: The invention provides a method for the preparation of relief structures of highly heat-resistant polymers, using radiation-sensitive, soluble preliminary polymers in the form of polyaddition or polycondensation products of polyfunctional carbocyclic or heterocyclic compounds containing radiation-sensitive radicals in ester groups bound to said compounds with diamines, diisocyanates, bis-acid chlorides or dicarboxylic acids of cyclic structure. According to the invention, the polyfunctional compounds carrying the radiation-sensitive radicals have, besides carboxyl, carboxylic acid chloride, amino, isocyanate or hydroxyl groups suitable for addition and condensation reactions, radiation-reactive radicals in the ester-groups bound to the compounds, partly in ortho or peri position thereto of the following structure: ##STR1## wherein: R.sub.1 = alkylene or aralkyleneR.sub.2 = h, ch.sub.3, clR.sub.

Abstract: The invention provides epoxy resin casting compounds based on polyepoxides, polycarboxylic acids and/or polycarboxylic acid anhydrides with directly or latently present carboxyl functions, which can be converted by polyaddition and/or polymerization into insoluble and unmeltable cross-linked polymers. According to the invention, the carboxyl functions are replaced, at least partially, by maleic acid monoallyl ester and a polymerization-initiating radical former, the maleic acid monoallyl ester component being present in the reaction mixture in free form and/or in the form of adducts to the polyepoxide. The epoxy resin casting compounds constitute systems which can be processed in a wide temperature range and are cross-linked rapidly at elevated temperature.

Abstract: The invention provides mixtures based on resins containing allyl groups and being solid at room temperature, useful for the preparation of thermally stable, photo-crosslinkable layers and foils. According to the invention, such mixtures comprise triallylcyanurate prepolymers and/or triallylcyanurate precopolymers with compounds containing allyloxy and/or allylester groups, and compounds with at least one N-maleimide group, wherein the C.dbd.C double bond of the N-maleimide groups are bonded to hydrogen, hydrogen and chlorine or hydrogen and methyl radicals. Preferably, the N-maleimide C.dbd.C bonds carry hydrogen.

Abstract: The invention provides a method for the preparation of solvent soluble, highly heat-resistant layered structures, using radiation-sensitive, soluble, preliminary polymers. According to the invention, soluble preliminary polymers are used which are prepared in a hexamethyl phosphoric acid triamide solution and which comprise polycondensation products of primary diamines with bicyclo[2.2.2.]octene-7-tetra carboxylic acid-2,3,5,6-diester-bis-acid chlorides wherein the ester groups are in the orthoposition with respect to the acid chloride groups and contain radiation-reactive radicals. Optionally di-ortho-tetracarboxylic acid-diester-bis-acid chlorides and/or di-ortho-tetracarboxylic acid-bis-anhydrides, carrying radiation-reactive ester radicals, can also be used in addition to the bicyclo[2.2.2.]octene-7-tetra carboxylic acid-2,3,5,6-diester-bis-acid chlorides.

Abstract: The invention provides a method for the preparation of relief structures of highly heat-resistant polymers, using radiation-sensitive, soluble preliminary polymers in the form of polyaddition or polycondensation products of polyfunctional carbocyclic or heterocyclic compounds containing radiation-sensitive radicals in ester groups bound to said compounds with diamines, diisocyanates, bis-acid chlorides or dicarboxylic acids of cyclic structure. According to the invention, the polyfunctional compounds containing the radiation-sensitive radicals contain, besides carboxyl, carboxylic acid chloride, amino, isocyanate or hydroxyl groups suitable for addition or condensation reactions, partly in ortho or peri-position thereto, radiation-reactive radicals in the ester groups bound to the compounds having an oxyalkylene methacrylate or acrylate structure.

Abstract: Novel cyclic monomers leaving two functional groups capable of undergoing condensation reactions to form amide, urea or urethane linkages and at least one photo or radiation-reactive group are condensed with cyclic comonomers to form a soluble, substantially-linear condensation pre-polymer. A solution of the prepolymer is applied to a substrate and the solution is evaporated off to form a film or foil. The photo or radiation-sensitive layer or foil is exposed or irradiated through a pattern, the unexposed or unirradiated part is dissolved or stripped off, and the relief structure which remains is annealed if necessary. The relief structures obtained are distinguished particularly by the sharpness of their edges, good mechanical and chemical properties as well as good insulating properties. They are suited particularly for the preparation of miniaturized insulating layers.

Abstract: In a method for the manufacture of formed elongated articles of cross-linked polyethylene in which the polyethylene is shaped in the non-cross-linked condition and is subsequently cross-linked by the application of heat in the presence of organic radical-forming agents, the improvement wherein 0.1 to 20% by weight of polyethylene of a cross-link promoting coagent selected from the group consisting of 2,4-dienoxy-6-amino-alkyl(ene)-s-triazines and N,N'-bis-(2,4-dienoxy-s-triazine-6)-diamines, is admixed with the polyethylene and is thereafter shaped and continuously cross-linked by application of heating at about atmospheric pressure and at a temperature above about 150.degree.C. and below the decomposition temperature of the components of the mixture.

Abstract: The invention provides a method for the preparation of relief structures of highly heat-resistant polymers, using radiation-sensitive, soluble preliminary polymers in the form of polyaddition or polycondensation products of polyfunctional carbocyclic or heterocyclic compounds containing radiation-sensitive radicals in ester groups bound to said compounds with diamines, diisocyanates, bis-acid chlorides or dicarboxylic acids of cyclic structure. According to the invention, the polyfunctional compounds containing the radiation-sensitive radicals contain, besides carboxyl, carboxylic acid chloride, amino, isocyanate or hydroxyl groups suitable for addition or condensation reactions, partly in ortho or periposition thereto, radiation-reactive radicals in the ester groups bound to the compounds having an oxyalkylene methacrylate or acrylate structure.