Patents by Inventor Wolfgang Klucken

Wolfgang Klucken has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting silicon wafers on metallic mounting surfaces
    Patent number: 5215244
    Abstract: A method of mounting a semiconductor wafer (10) on a metallic mounting surface, particularly during manufacture of valves with macromechanical valve bodies (20), features the steps of applying a metallization (11) to at least one major surface of the semiconductor wafer, and thereafter soldering the thus-metallized major surface, either wholly or in localized surface areas, to the metallic mounting surface.
    Type: Grant
    Filed: February 24, 1992
    Date of Patent: June 1, 1993
    Assignee: Robert Bosch GmbH
    Inventors: Juergen Buchholz, Hans-Peter Trah, Wolfgang Klucken