Abstract: A process and an apparatus for the peeling of wire wound into a coil and/or to be wound into a coil in a wire peeling machine. The wire is peeled bent in the form of a loop, with the individual wire loops having a curvature corresponding essentially to the curvature of the wire in the coil and the wire loops being separated so that the wire is being guided on a helically curving path. At least in one location a piece of a wire loop is spaced apart from two adjacent pieces of the adjacent loops so that a peeling head peeling a first loop piece may be accommodated between the two other loop pieces. In particular, the wire is guided helically on the circumferential surface of a partial annular torus or a cylinder. The wire may be peeled directly, i.e., without prior straightening. The axis of rotation of the peeling head is perpendicular to the plane formed by the curved axis of the coil, which also contains the axes of the disk or disks. The axis of rotation of the peeling head is horizontal.