Patents by Inventor Wolfgang Ludeck

Wolfgang Ludeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9986648
    Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: May 29, 2018
    Assignees: SIEMENS AKTIENGESELLSCHAFT, KLEB-UND GIESSHARZTECHNIK DR. LUDECK GMBH
    Inventors: Michael Hanisch, Heiko Huth, Wolfgang Ludeck, Bernd Mueller, Mathias Nowottnick, Andrey Prihodovsky, Dirk Seehase, Ulrich Wittreich, Dirk Wormuth
  • Publication number: 20180110131
    Abstract: The present disclosure relates to SMD mounting. The teachings thereof may be embodied in heating elements having a mounting side for SMD mounting, the mounting side being available for placing onto a substrate, for example in the form of a circuit carrier, electronic assemblies with a circuit carrier and a component, and/or methods for producing an electronic assembly having a circuit carrier and a component placed on the circuit carrier. For example, a heating element may include: a mounting side for SMD mounting; a housing enclosing a cavity; and a reactive substance in the cavity that reacts exothermically at a reaction temperature T1.
    Type: Application
    Filed: March 29, 2016
    Publication date: April 19, 2018
    Applicants: Siemens Aktiengesellschaft, Kleb- und Giessharztechnik Dr. Ludeck GmbH
    Inventors: Michael Hanisch, Heiko Huth, Wolfgang Ludeck, Bernd Mueller, Mathias Nowottnick, Andrey Prihodovsky, Dirk Seehase, Ulrich Wittreich, Dirk Wormuth
  • Publication number: 20110162871
    Abstract: Solder materials, such as a solder paste, and contact surfaces for solder connections are provided in which a metal stearate is used as a flux. The metal stearate is applied either as a solid layer on the solder particles or as contact surfaces or is present as a dispersion or solution in a binder. Advantageously, such materials allow one to avoid the use of classical fluxes. In particular, non-resin solder materials can be provided. A simplified storage and processability of the solder materials results, while at the same time producing comparatively better solder connections. The ability to use metal stearates as a flux is achieved if the first oxide of the metals used is formed from pure metal at lower oxygen activity (ao) than the first chromium oxide of chromium, preferably lower than the first titanium oxide of titanium, and if the metal stearate is present in a sufficient amount.
    Type: Application
    Filed: June 26, 2009
    Publication date: July 7, 2011
    Applicant: W.C. HERAEUS GMBH
    Inventors: Rolf Diehm, Wolfgang Ludeck, Andrey Prihodovsky, Wolfgang Schmitt, Hubert Trageser, Andreas Fix, Matthias Hutter, Uwe Pape, Patrick Zerrer, Hartmut Meier, Bernd Müller, Ulrich Wittreich, Dirk Wormuth