Patents by Inventor Wolfgang MANHART

Wolfgang MANHART has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic printed circuit board assembly for high-power components
    Patent number: 11272617
    Abstract: The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), and the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 500). The composite printed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20).
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: March 8, 2022
    Assignee: ZKW Group GmbH
    Inventors: Dietmar Kieslinger, Erik Edlinger, Markus Lahner, Wolfgang Manhart
  • Electronic Printed Circuit Board Assembly for High-Power Components
    Publication number: 20210092846
    Abstract: The invention relates to an electronic module (40) comprising at least one printed circuit board of a first type (referred to as “printed circuit board A”), which is equipped in an overlapping manner with at least one printed circuit board of a second type (referred to as “printed circuit hoard B”), printed circuit board B being equipped with at least one electronic component with specific requirements (19), mid the interconnected printed circuit boards A and B forming a stepped composite printed circuit board (100, 200, 300, 400, 300). The composite primed circuit board (100, 200, 300, 400, 500) is delimited at least in some regions by end regions (16) which are formed by sections of the at least one printed circuit board A, and the composite printed circuit board (100, 200, 300, 400, 500) is placed on a heat sink (20).
    Type: Application
    Filed: January 16, 2019
    Publication date: March 25, 2021
    Inventors: Dietmar KIESLINGER, Erik EDLINGER, Markus LAHNER, Wolfgang MANHART