Abstract: A method of manufacturing a housing and a housing for an inductive sensor having at least one sleeve-like housing part and at least one beaker-like end cap for a sensor element, wherein the beaker-like end cap, wherein the end cap is composed of plastic, wherein the end cap is arranged in the sleeve-like housing part, wherein the end cap has a peripheral annular pressing surface that has an excess size with respect to an inner diameter of the housing part along an outer diameter of the sleeve-like section so that a press fit is formed between the sleeve like housing part and the end cap, and wherein a jacket-like outer surface of the sleeve-like section of the end cap does not have a step that projects beyond the inner diameter of the sleeve-like housing part.

Abstract: A method of manufacturing a housing and a housing for an inductive sensor having at least one sleeve-like housing part and at least one beaker-like end cap for a sensor element, wherein the beaker-like end cap, wherein the end cap is composed of plastic, wherein the end cap is arranged in the sleeve-like housing part, wherein the end cap has a peripheral annular pressing surface that has an excess size with respect to an inner diameter of the housing part along an outer diameter of the sleeve-like section so that a press fit is formed between the sleeve like housing part and the end cap, and wherein a jacket-like outer surface of the sleeve-like section of the end cap does not have a step that projects beyond the inner diameter of the sleeve-like housing part.

Abstract: The invention relates to a plug-in module for a sensor (32) comprising a sleeve-like housing (3) in which a sensor element (27), a carrier board (16) carrying an electronic circuit and a plug-in unit (2) are positioned. In a plug-in module which can be used equally for sensors of different sizes, an outer diameter (5) of the plug-in unit (2) approximately corresponds to a smallest inner diameter (8) of the sleeve-like housing (3), wherein a coding sleeve (4) is inserted between the plug-in unit (2) and the sleeve-like housing (3).

Abstract: The invention relates to a plug-in module for a sensor (32) comprising a sleeve-like housing (3) in which a sensor element (27), a carrier board (16) carrying an electronic circuit and a plug-in unit (2) are positioned. In a plug-in module which can be used equally for sensors of different sizes, an outer diameter (5) of the plug-in unit (2) approximately corresponds to a smallest inner diameter (8) of the sleeve-like housing (3), wherein a coding sleeve (4) is inserted between the plug-in unit (2) and the sleeve-like housing (3).

Abstract: The aim of the invention is to provide a simple and economical device for opening and closing separate suction openings (13, 14, 15) of a device (1) which is provided for treating substrates, especially semiconductor wafers, and which comprises a treatment reservoir (3). Said treatment reservoir is filled with a treatment fluid and is arranged in an essentially closed space that has at least two separate suction openings (13, 14, 15). To this end, a rotatable disc (17) is provided which covers up the suction opening while isolating it from the space and which comprises a through-opening (18). One of the suction openings (13, 14, 15) can be at least partially overlapped by said through-opening.