Abstract: A corona shielding band having reproducible qualities and allowing only a small increase in dielectric losses in a winding of an insulation of electrical machine is made by impregnating a woven-type support material with an active resin solution containing an inorganic filler with a coating composed of antimony-doped tin oxide and then removing the solvent by a thermal processing to produce the corona shielding band.

Abstract: The invention relates to novel 2-(N,N-di(het)arylamino)-thiophene derivatives of formula (I), wherein R1, R2, R3, R4l and R5 are, independently each of other, each a monofunctional (het)aryl system and wherein R1 can also be a bifunctional (het)arylene system, R3 can also be a group R8, except when R1 is a bifunctional (het)arylene system, R8 representing chemical bond or a bifunctional (het)arylene system, R4 can also mean R10, R10 representing a chemical bond or a bifunctional (het)arylene system, or R4 can be one of the following groups (II) and (I), R9 representing a chemical bond or a bifunctional (het)arylene system and R5 can also be H or (IV).

Abstract: In a rotating electrical machine having a permanent-magnet rotor, the tubular, highly thermally conductive supporting body of the stator forms a thermal bridge to a cooling means. In order to allow the end windings of the stator windings to be cooled effectively as well, the end windings also each have an associated thermal bridge, which completely fills the space between the end windings and the supporting body of the stator. This thermal bridge is of solid construction having a solid ring, which is connected to the supporting body of the stator with a force fit, and a cast-resin body which is cast into this solid ring. The cast-resin body has a thermal conductivity of more than 1.6 W/mK and, for this purpose, contains a powdery, highly thermally conductive filler making up a proportion of 50 to 90% by weight, preferably an aluminum nitride coated with silicon dioxide.

Abstract: In a rotating electrical machine having a permanent-magnet rotor, the tubular, highly thermally conductive supporting body of the stator forms a thermal bridge to a cooling means. In order to allow the end windings of the stator windings to be cooled effectively as well, the end windings also each have an associated thermal bridge, which completely fills the space between the end windings and the supporting body of the stator. This thermal bridge is of solid construction and comprises a solid ring, which is connected to the supporting body of the stator with a force fit, and a cast-resin body which is cast into this solid ring. The cast-resin body has a thermal conductivity of more than 1.6 W/mK and, for this purpose, contains a powdery, highly thermally conductive filler making up a proportion of 50 to 90% by weight, preferably an aluminum nitride coated with silicon dioxide.

Abstract: New initiators which are suitable for cationic polymerization have the following structure: ##STR1## such that following apply: R.sup.1 and R.sup.2 are alkyl or cycloalkyl or they, together with the S atom, form a heterocyclic ring,R.sup.3 is H or alkyl,R.sup.4, R.sup.5, R.sup.6, and R.sup.7 are H, alkyl, or alkoxy,X.sup.-- is a non-nucleophilic anion.Reaction resin mixtures with initiators of this type contain, in addition to a cationically polymerizable monomer and/or oligomer, 0.01 to 10% by mass of the initiator.

Abstract: Curable reaction resin mixtures which are suitable for stereolithography have the following composition:a cationically curable monomer and/or oligomer,an initiator with the following structure: ##STR1## where the following applies: R.sup.1 and R.sup.2 are alkyl or cycloalkyl, or together with the S atom they form a heterocyclic ring,R.sup.3 is H or alkyl,R.sup.4, R.sup.5, R.sup.6 and R.sup.7 are H, alkyl or alkoxy,X.sup.- is a non-nucleophilic anion,and optionally a filler, pigment and/or additive.

Abstract: The present invention relates to phosphorus-modified epoxy resins of the formulae (I) and/or (II) ##STR1## The invention furthermore relates to a process for the preparation of these phosphorus-modified epoxy resins and to their use for the production of shaped articles, coatings or laminates.

Abstract: Epoxy resin mixtures for prepregs and compositesEpoxy resin mixtures for preparing prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin;an aromatic polyamine used as a hardening agent.

Abstract: Epoxy resin mixtures for the production of prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule, and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;an amine-substituted aromatic sulfonic acid amide or hydrazide as a hardener;an amino hardening accelerator.

Abstract: The present invention relates to phosphorus-modified epoxy resins having an epoxy number from 0 to 1 mol/100 g, comprising structural units which are derived from(A) polyepoxy compounds having at least two epoxy groups per molecule, and(B) phosphinic and/or phosphonic anhydrides.The invention further provides a process for preparing these phosphorus-modified epoxy resins and provides for the use of the resins in producing moldings, coatings or laminates.

Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) at least one compound from the group consisting of phosphinic acids, phosphonic acids, pyrophosphonic acids and phosphonic acid half-esters, andan aromatic polyamine as the hardener.

Abstract: Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from(A) polyepoxy compounds with at least two epoxy groups per molecule and(B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, andan aromatic polyamine as the hardener.

Abstract: The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin;(B) an epoxy-group-containing phosphorous compound and(C) an aromatic polyamine as a curing agent.

Abstract: The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin which is free of phosphorous, optionally in combination with an aliphatic epoxide resin;(B) an epoxide-group-containing phosphorous compound;(c) an aromatic polyamine as a curing agent; and(D) filler material.

Abstract: The supply of current pulses to gradient coils in a magnetic resonance imaging tomography apparatus results in physical vibration of the coils, causing acoustic noise. For reducing such acoustic noise, a gradient coil system is disclosed wherein the individual gradient coils are secured on a tubular carrier formed by a two concentric shells. The two shells are joined to each other in a manner which is rigid against shearing in the longitudinal direction by connector elements. The self-excited vibrational behavior of the gradient coil system is thereby tuned to lower vibrational amplitudes and to higher vibrational frequencies, so that a more effective damping can be achieved with acoustic damping measures.

Abstract: An insulating tape for manufacturing an insulating sleeve, impregnated with a hot-curing epoxy-resin acid-anhydride system, for electrical conductors.The insulating tape for manufacturing an insulating sleeve, impregnated with a hot-curing epoxy resin-hardener system, consists of an inorganic material, of high dielectric strength which is applied to a flexible support and is bonded by means of a binder and contains an accelerator which promotes the curing reaction, whereby the binder/accelerator mixture constitutes a system that is self-curing at the curing temperature of the impregnating resin.In the case of the binder/accelerator mixture, the binder consists of a physiologically innocuous, ring-epoxidized, cycloaliphatic epoxy resin, modified by molecular enhancement, with an epoxide equivalent greater than 200, and the accelerator adducts of piperazines, substituted in 1 position, with (meth)acrylate compounds.

Abstract: Reaction resin mixtures which can be economically processed provide inflammable molded materials with excellent mechanical properties and high dimensional stability under heat when they contain the following constituents: (A) a phosphorus-free polyfunctional epoxide; (B) an epoxy-group-containing phosphorus compound; (C) a polyfunctional isocyanate; (D) a curing catalyst; and, if required, (E) filler material.

Abstract: Insulating tape for making an impregnated insulating sleeve for electric conductors. An insulating tape based on breakdown-proof inorganic material and a bonding agent/accelerator mixture is developed in such a manner that, by means of heat-hardening impregnating resins, insulating sleeves for electric conductors with improved thermal-mechanical properties can be made therefrom. To this end, the bonding agent/accelerator mixture is a mixture of an epoxy resin/(meth) acrylic acid adduct, a bismaleimide resin and an adduct of a secondary amine and a polyfunctional (meth) acrylic acid ester which may optionally contain an organic peroxide.

Abstract: Optical glass fibers are provided with a primary coating of organo-polysiloxanes, containing acrylic acid ester groups, corresponding to the general formula: ##STR1## where the primary coating is free of inert components capable of migration.

Abstract: The present invention is directed to an optical glass fiber with a primary coating of organo-polysiloxanes containing acrylic acid ester groups which coating is inter alia hydrolysis stable and rapidly curable.