Patents by Inventor Wolfgang Santer

Wolfgang Santer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF
    Publication number: 20070287279
    Abstract: A method for forming solder connections using dummy vias and the device. The dummy vias are formed prior to the application of ball limiting metals or solder material. After placing the under ball materials and the solder materials, the material covering the dummy vias has an increased surface contact and thus provide improved robustness and lifetime of the solder connection. Structures of implementation of the method are provided with either completely or partially filled dummy vias.
    Type: Application
    Filed: June 8, 2006
    Publication date: December 13, 2007
    Inventors: Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Santer