Abstract: A method for controlling a driving dynamics function of a working machine with at least two vehicle axles. A current actual wheel rotational speed of at least one wheel is detected and sent to a control unit for comparison with an acceptable wheel rotational speed of the same wheel and wheel slip is calculated from that comparison. The control unit emits a control signal to lock at least one differential gear system if the wheel slip has an unacceptable value. For the differential gear system (4, 5, 6, 7, 8) concerned, an unlocking control signal is periodically emitted and the wheel rotational speeds are compared afresh. A control signal to lock the differential gear system concerned is emitted again if the value of the wheel slip is still unacceptable, and a trajectory is detected with reference to detection elements, along which the value of the wheel slip of the at least one wheel has been unacceptable.

Abstract: An electronic device includes: (i) first and second integrated circuit (IC) dies co-located on a surface of a substrate in proximity to each other, (ii) a heat sink disposed on the first and second IC dies, and (iii) a lid, which is disposed between the first IC die and the heat sink, and the lid is not disposed between the second IC die and the heat sink.

Abstract: An electronic network device includes: (i) an integrated circuit (IC) die disposed on a substrate and configured to exchange signals between the electronic network device and one or more other devices that are remote from the electronic network device, (ii) a plurality of transceiver dies disposed on the substrate and configured to transmit and receive the signals between the IC die and the other devices, one or more of the transceiver dies being spaced away from the IC die, and (iii) one or more decoupling capacitors configured to improve an integrity of one or more of the signals communicated within the electronic network device, the one or more decoupling capacitors being disposed in an area between the IC die and the one or more transceiver dies being spaced away from the IC die.

Abstract: An electronic network device includes: (i) an integrated circuit (IC) die configured to exchange signals between the electronic network device and one or more other devices that are remote from the electronic network device, (ii) a plurality of transceiver dies, separate from the IC die, the plurality of transceiver dies being disposed along at least a first axis extending at an acute angle from an edge of the IC die and intersecting the edge at a first point, the transceiver dies being configured to exchange the signals between the IC die and the other devices, and (iii) electrical connections configured to connect between the IC die and at least one of the transceiver dies for exchanging at least some of the signals between the IC die and the transceiver dies.

Abstract: An integrated circuit device includes a main integrated circuit die having functional circuitry configured to communicate over a network through one or more high-speed communications interfaces, and at least one secondary integrated circuit die including serial interface circuitry. Each integrated circuit die among the at least one secondary integrated circuit die is mounted on a first surface of the main integrated circuit die, and first metallization connections extend along one or more first through-silicon vias between the functional circuitry and the serial interface circuitry of the at least one secondary integrated circuit die. The first metallization connections may be configured to provide data from the main die to the secondary die, and the secondary die may be configured to communicate data between the integrated circuit device and a remote integrated circuit device. Second metallization connections extend between the serial interface circuitry of and terminals of the main integrated circuit die.

Abstract: An integrated circuit device package includes a substrate, at least two integrated circuit dies mounted to the substrate, and a thermally conductive stiffener attached to the substrate to counteract warping of the substrate. The stiffener has a first portion in a thermally conductive relationship with a surface of a first integrated circuit die to provide a first heat dissipation mode for the first integrated circuit die, and has a second portion, different from the first portion, the second portion being configured to provide a second heat dissipation mode, different from the first heat dissipation mode, for a second integrated circuit die. The stiffener may be configured to expose a surface of the second integrated circuit die through an opening in the stiffener. A heat sink may be disposed in a thermally conductive relationship with the second integrated circuit die through the opening in the stiffener.

Abstract: The present invention relates to a surgical clip, comprising a first clamping arm, a second clamping arm, and a biasing element, which first clamping arm defines a first clamping surface, which second clamping arm defines a second clamping surface, and which biasing element holds the first clamping surface and the second clamping surface against each other in a basic position, in particular under bias, wherein the first and the second clamping arm are pivotable against each other counter to the action of the biasing element, wherein the biasing element is configured in the form of a coil spring which defines a coil spring longitudinal axis and has a first coil spring end and a second coil spring end, wherein the coil spring comprises between the first coil spring end and the second coil spring end at least one winding extending over a circumferential angle of more than 360°.

Abstract: A surgical gripping/holding instrument having two instrument branches which are coupled pivotably with respect to one another. Each branch has a distal gripping/holding portion, a proximal instrument actuating portion, and an intermediate region which connects the distal and proximal portions preferably integrally, and having an instrument lock, of which the locking elements which can be brought into latching engagement with one another are arranged or formed on the instrument branches. The actuation of the instrument for opening and closing is functionally separated from actuation of the instrument for locking and unlocking the instrument by the positioning of the instrument lock in the intermediate region of the instrument. Therefore, each actuation can be carried out individually.

Abstract: A surgical clip of branch-crossed design has two Z-shaped clip branches connected to each other at a proximal end of each of the clip branches by a spring-elastic connection piece. Each of the clip branches has a jaw part at a distal section with a gripping surface. In an assembled position of the clip, the clip branches cross and the gripping surfaces are opposite each other and are held in contact on one another by a closing force of the spring-elastic connection piece. At least one first clip branch has a groove in which the second clip branch is held and/or guided, at least in sections, such that a displacement of the clip branches in a transverse direction of the clip branches is prevented.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.

Abstract: A surgical gripping/holding instrument having two instrument branches which are coupled pivotably with respect to one another. Each branch has a distal gripping/holding portion, a proximal instrument actuating portion, and an intermediate region which connects the distal and proximal portions preferably integrally, and having an instrument lock, of which the locking elements which can be brought into latching engagement with one another are arranged or formed on the instrument branches. The actuation of the instrument for opening and closing is functionally separated from actuation of the instrument for locking and unlocking the instrument by the positioning of the instrument lock in the intermediate region of the instrument. Therefore, each actuation can be carried out individually.

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.

Abstract: A surgical clip includes two clip branches which are spring-elastically joined and pretensioned at proximal ends by a first spring element which can be rotated about a spring pivot point formed by the first spring element. The distal free ends of the clip branches are held in parallel against one another in a resting position of the surgical clip via the closing force of the first spring element. The surgical clip has a conversion device which reduces a ratio of opening force, applied to a force-guiding path for opening the clip branches, to opening angle, from a predetermined opening angle of the distal free ends of the two clip branches. A method for opening the clip includes the step of applying pressure to the clip branches on a force-guiding path formed between crossing portions and the first spring element.

Abstract: The present invention relates to a surgical clip, comprising a first clamping arm, a second clamping arm, and a biasing element, which first clamping arm defines a first clamping surface, which second clamping arm defines a second clamping surface, and which biasing element holds the first clamping surface and the second clamping surface against each other in a basic position, in particular under bias, wherein the first and the second clamping arm are pivotable against each other counter to the action of the biasing element, wherein the biasing element is configured in the form of a coil spring which defines a coil spring longitudinal axis and has a first coil spring end and a second coil spring end, wherein the coil spring comprises between the first coil spring end and the second coil spring end at least one winding extending over a circumferential angle of more than 360°.

Abstract: A pillar-type connection includes a first conductive layer that includes a hollow core. A second conductive layer is connected to the first conductive layer defining a conductive pillar that includes a top surface defining a recess aligned with the hollow core.

Abstract: A surgical clip of branch-crossed design has two Z-shaped clip branches connected to each other at a proximal end of each of the clip branches by a spring-elastic connection piece. Each of the clip branches has a jaw part at a distal section with a gripping surface. In an assembled position of the clip, the clip branches cross and the gripping surfaces are opposite each other and are held in contact on one another by a closing force of the spring-elastic connection piece. At least one first clip branch has a groove in which the second clip branch is held and/or guided, at least in sections, such that a displacement of the clip branches in a transverse direction of the clip branches is prevented.

Abstract: Disclosed is a multi-chip module (MCM) with redundant chip-to-chip communication connection(s) to minimize the need to discard a chip-mounting layer due to defective signal traces. The MCM includes at least first and second chips mounted on the chip-mounting layer. The chip-mounting layer includes signal traces that are electrically connected between first and second links on the first and second chips, respectively, to form communication connections including at least one redundant communication connection. Instead of being directly connected to the chip-to-chip communication connections, first and second interfaces on the first and second chips are connected via first and second multiplexors, respectively, to selected ones of multiple chip-to-chip communication connections. By employing the multiplexors and the redundant chip-to-chip communication connection(s), chip-to-chip communication connection(s) with defective signal trace(s) can be bypassed.

Abstract: An IC chip structure including a plurality of IC chips electrically connected to one another in back-end-of-line (BEOL) interconnect layer of the structure is disclosed. The IC structure may include openings in crack-stop structures surrounding the IC chips and a interconnect wire extending between the IC chips through the openings. A packaging structure for utilizing the IC structure where at least one IC chip is inoperable is also disclosed. The structure may include a first bond pad array on a top surface of a packaging substrate including operable bond pads connected to an operable IC chip and structural support bond pads connected to the inoperable IC chip; a second bond pad array on a bottom surface of the substrate including operable bond pads connected to a single IC chip printed circuit board; and an interconnect structure for connecting the operable bond pads of the first and second bond pad arrays.

Abstract: A gas-permeable filter system for a sterile container includes a filter element and a seal portion that sealingly surrounds a gas exchange opening provided in a sterile container wall section in such a manner that the seal portion rests against the sterile container wall section so that a sterile flow path is formed through the gas exchange opening and the filter element. A temperature-sensitive adjusting section releases at least the seal portion from the sterile container wall section when a specified temperature is reached or exceeded such that a non-sterile flow path is formed which allows fluid to be supplied or discharged via the gas exchange opening while bypassing the filter element. The sterile container includes a base and walls that define a receiving space. The sterile container also includes a cover for closing the receiving space. At least one filter system is preferably secured to the sterile container base.

Abstract: A method of manufacturing a bond pad structure may include depositing an aluminum-copper (Al—Cu) layer over a dielectric layer; and depositing an aluminum-chromium (Al—Cr) layer directly over the Al—Cu layer.