Abstract: Method and arrangement for making electrical contact with a membrane-enveloped object using an electrode The invention relates, inter alia, to a method for making electrical contact with a membrane-enveloped object (30) using an electrode (10, 100). According to the invention, it is provided that at least one electrode (100) comprising a conductive carrier (110) is used for making contact, on which carrier a multiplicity of nanoneedles (120) are arranged and on which carrier adjacent nanoneedles are at a distance from one another which is smaller than the size of the object, and that the object is brought into contact with the nanoneedles.

Abstract: Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.

Abstract: Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.

Abstract: The method for the manufacture of multilayer connecting substrates with multiple functions comprises the design of the connecting substrate taking place in functionally separated manner, in that signal conducting substrate parts (19), power supplying substrate parts (2), mechanical substrate parts (7), as well as the arrangement of components (4) or component-carrying substrate parts is separately planned and optimized as independent functions or modules and finally associated with spatially separated functional areas (inner/outer) of the overall circuit, the design taking place by the connection of the modules to an overall circuit embodying the connecting substrate. The resulting multilayer circuit with conductor network (19, 2), components (4) and mechanical stiffening elements (7) has the following structure.

Abstract: The invention relates to the production of thin metal layers and structures thereof on substrates of various structures. The lateral extent of a metal layer on the respective substrate can be prescribed with a precision in the micron and submicron range. The method described makes it possible to manufacture flat and three-dimensional metal structures on smooth planar or curved surfaces, as are required, for example, for depicting writing or drawings. The method uses no printing techniques.

Abstract: A method of and an apparatus for vapor phase/solder wave soldering contacts of electronic components including temperature sensitive portions in wh the components while moving through a soldering chamber are only partially immersed in a saturated vapor whereas the contacts are wholly immersed in the vapor. A solder wave having a crest substantially coinciding with the components to be soldered is provided within the saturated vapor and a layer of an inert gas is provided above the vapor ceiling.

Abstract: In the process according to the invention for soldering electronic boards, in particular, printed circuit boards with devices installed on them, first, during the pickling process, a condensable process material, for example, water, is introduced into flaws in the oxide layers on the soldering connection surfaces and at least partially condensed in the flaws. Then, the oxide layers are exposed to rapid heating such that the process material condensed in the flaws vaporizes explosively and thus the oxide layer breaks up and cracks off of the basis material, such that the soldering connection surfaces for the subsequent actual soldering process are brought to virgin condition. In the case of wave soldering, the rapid heating occurs preferably by means of the wave of solder itself. If non-oxide passive layers must also be removed, this occurs preferably in a preceding stage of the pickling process, during which the oxide layer is hydrophilized. For this, a plasma pretreatment is suitable.

Abstract: The invention is directed to a procedure for processing joints to be soldered, preferably printed circuit boards fitted with electric components, and an arrangement for executing this procedure, wherein the joints are subjected to plasma treatment before the soldering process. The joints may be subjected to plasma treatment separately or in the relative position necessary for the soldering process.

Abstract: Vertically oriented cathode grids or cathode plates, adjacently situated at closely spaced intervals in a cathode box, are cleaned by spraying jets of liquid onto the cathode surfaces at an angle of about 10.degree.-50.degree. and at a pressure of about 60 to 140 atmospheres, while moving the liquid jets uniformly along the cathode surfaces. A device for performing this process comprises a bar shaped spraying means comprising spraying nozzles which are connected to pressure resistent feeding means for the liquid.