Patents by Inventor Wolfgang Scheucher

Wolfgang Scheucher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contactless communication data carrier with fully enclosed holding means for holding a chip and a passive component
    Patent number: 6321994
    Abstract: The data carrier of a device provided with the data carrier includes a casing which is formed by injection molding and which accommodates a holding device for holding a chip and at least one transmission coil, and also includes an electrically conductive connector connected to the holding device and arranged to connect the chip terminals of the chip to the coil terminals of the transmission coil. The holding device includes a holding foil and the connector is realized while utilizing a conductor frame. The connector is formed by conductor segments of the conductor frame with parts of the conductor segments connected to the holding foil in order to hold the conductor segments. The entire holding foil and the parts of the conductor segments which are connected to the holding foil are fully enclosed by the casing.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: November 27, 2001
    Assignee: U.S. Philips Corporation
    Inventors: Marcus Toth, Wolfgang Scheucher, Gerald Schaffler, Heinz Kwas
  • Device arranged for contactless communication and provided with a data carrier with fully enclosed connection means for electrically connecting a chip and a passive component
    Patent number: 6275158
    Abstract: The data carrier (4) of a device (1) provided with a data carrier (4) includes a casing (5) which is formed by injection molding and in which there are accommodated holding means (6) for holding a chip (7) and at least one transmission coil (8), and also includes electrically conductive connection means (16) which are connected to the holding means (6) and are arranged to connect the chip terminals (9, 10) of the chip (7) to the coil terminals (11, 12) of the transmission coil (8); the holding means (6) include a holding foil (17) and the connection means (16) are realized while utilizing a conductor frame (18) and are formed by conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) of the conductor frame (18) and are completely enclosed by the casing (5), at least parts of said conductor segments (20, 21, 22, 23, 24, 25, 28, 29, 30, 31; 42, 43, 45, 46) being connected to the holding foil (17) in order to hold said conductor segments.
    Type: Grant
    Filed: December 20, 1999
    Date of Patent: August 14, 2001
    Assignee: U.S. Philips Corporation
    Inventors: Marcus Toth, Wolfgang Scheucher, Gerald Schaffler, Heinz Kwas