Patents by Inventor Wolfgang Schnitzerlein

Wolfgang Schnitzerlein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8537556
    Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.
    Type: Grant
    Filed: April 6, 2009
    Date of Patent: September 17, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Patent number: 8441803
    Abstract: A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 14, 2013
    Assignee: Siemens Aktiengesellschaft
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Publication number: 20090257206
    Abstract: The invention specifies a holding apparatus comprising a support element and a circuit board. A trench for receiving the circuit board is embodied in the support element. At least one first clamping element is arranged on one or both longitudinal sides of the circuit board and/or at least one second clamping element is arranged in the trench. As a result, the circuit board received by the trench is fixed in the trench in a clearance-free fashion.
    Type: Application
    Filed: April 6, 2009
    Publication date: October 15, 2009
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy
  • Publication number: 20090251871
    Abstract: A retaining facility for clearance-free fixing of a printed circuit board onto a one-dimensional curved surface is provided. In the direction of curvature of the one-dimensional curved surface, a tensile or compressive force acts on the printed circuit board or on at least one first connection device connected to the latter, with the printed circuit board being bent and pressed onto the curved surface. In this way the printed circuit board is held solidly and with little vibration on the surface even when acted on by centrifugal forces.
    Type: Application
    Filed: March 31, 2009
    Publication date: October 8, 2009
    Inventors: Bernd Beyer, Horst Friesner, Markus Hemmerlein, Florian Hofmann, Helmut Repp, Wolfgang Schnitzerlein, Markus Stark, Peter Tichy