Patents by Inventor Wolfgang Teich

Wolfgang Teich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6946864
    Abstract: A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.
    Type: Grant
    Filed: February 19, 2002
    Date of Patent: September 20, 2005
    Assignee: Osram GmbH
    Inventors: Wolfgang Gramann, Raimund Oberschmid, Werner Sp├Ąth, Wolfgang Teich
  • Publication number: 20020166777
    Abstract: A measuring arrangement for measuring product parameters of a component in the epitaxial layer (28) of a wafer comprises measuring probe (3) on whose contact side (23) a recess (24) is installed, into which an electrolyte can be poured. The electrolyte produces an electrical connection between a contact body (11), which is charged with a signal from a pulsed-current source, and the surface (22) of the wafer (2). A detector (16) serves for detecting the light which is emitted by the component.
    Type: Application
    Filed: February 19, 2002
    Publication date: November 14, 2002
    Inventors: Wolfgang Gramann, Raimund Oberschmid, Werner Spath, Wolfgang Teich
  • Patent number: 5999552
    Abstract: A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing.
    Type: Grant
    Filed: January 20, 1998
    Date of Patent: December 7, 1999
    Assignee: Siemens Aktiengesellschaft
    Inventors: Georg Bogner, Herbert Brunner, Heinz Haas, Johann Luft, Ernst Nirschl, Werner Spaeth, Norbert Stath, Wolfgang Teich
  • Patent number: 4072372
    Abstract: A swivelable journal bearing for a shaft of a converter or other heavy-duty equipment comprises a spherically convex inner ring on the shaft and an annular array of rigidly interconnected socket elements each forming at least one seat for an inwardly projecting low-friction insert having a spherically concave face in contact with the ring surface. The socket elements may be short tubes welded to one another or embedded in a shell of concrete; they could also be perforated strips welded together and backed by a concrete shell.
    Type: Grant
    Filed: November 11, 1976
    Date of Patent: February 7, 1978
    Assignee: Kugelfischer Georg Schafer & Co.
    Inventors: Heinz Korrenn, Wolfgang Teich, Helmut Heimrich
  • Patent number: 4025129
    Abstract: A friction bearing having spaced-apart inner and outer bearing rings with a plurality of separate sliding members interposed therebetween, the individual sliding members being restrained by respective generally annular members positioned adjacent and on substantially encompassing the sliding members, and fixedly attached to one of the bearing rings.
    Type: Grant
    Filed: January 15, 1976
    Date of Patent: May 24, 1977
    Assignee: Kugelfischer Georg Schafer & Co.
    Inventors: Gunter Markfelder, Wolfgang Teich