Abstract: A device for correcting the free conductor ends of a conductor bundle has a support with parallel grooves for holding the ends in a parallel array, a vertically movable heated stamp for adhering or welding a strip of material to the exposed plastic jackets of the conductor ends on the support and a knife for cutting off the portions of the conductor ends extending beyond the connecting strip. The pressing stamp is mounted on a vertically movable carrier plate for vertical movement relative to the plate and is spring biased downwardly, and the knife is fixed to the carrier plate so that the pressing stamp engages and presses the connecting strip to the conductor jackets and the knife then serves the projecting conductor ends as a result of a single downward movement of the carrier plate.