Abstract: An antenna element and related apparatus are provided. The antenna element includes a radiating structure configured to radiate a radio frequency (RF) signal in a defined polarization (e.g., linear polarization or circular polarization). The radiating structure is conductively coupled to a first pair of feed ports and a second pair of feed ports. In examples discussed herein, at least one selected pair of feed ports among the first pair of feed ports and the second pair of feed ports can be dynamically configured to receive a differential signal(s). By applying the differential signal(s) to the selected pair of feed ports with a proper polarity and/or a relative phase differential, it may be possible to cause the radiating structure to radiate in the defined polarization without requiring additional circuitries (e.g., switching circuit), thus helping to reduce power consumption, heat dissipation, and/or footprint in an apparatus employing the antenna element.

Abstract: A radio frequency (RF) front-end apparatus is provided. In examples discussed herein, the RF front-end apparatus can be configured to communicate RF signals in millimeter wave (mmWave) RF frequencies (e.g., ?12 GHz). The RF front-end apparatus includes an RF front-end circuit and an antenna element. The RF front-end circuit includes a transmit path and a receive path for transmitting and receiving RF signals, respectively. The antenna element includes an input port(s) and an output port(s) that are coupled to the transmit path and the receive path, respectively. The antenna element can be configured to enable impedance matching between the input port(s) and the transmit path, as well as between the output port(s) and the receive path. As a result, it may be possible to reduce insertion losses in the RF front-end circuit, thus helping to improve performance of the RF front-end apparatus, particularly in support of mmWave communications.

Abstract: A radio frequency (RF) front-end apparatus is provided. In examples discussed herein, the RF front-end apparatus can be configured to communicate RF signals in millimeter wave (mmWave) RF frequencies (e.g., ?12 GHz). The RF front-end apparatus includes an RF front-end circuit and an antenna element. The RF front-end circuit includes a transmit path and a receive path for transmitting and receiving RF signals, respectively. The antenna element includes an input port(s) and an output port(s) that are coupled to the transmit path and the receive path, respectively. The antenna element can be configured to enable impedance matching between the input port(s) and the transmit path, as well as between the output port(s) and the receive path. As a result, it may be possible to reduce insertion losses in the RF front-end circuit, thus helping to improve performance of the RF front-end apparatus, particularly in support of mmWave communications.

Abstract: An antenna element and related apparatus are provided. The antenna element includes a radiating structure configured to radiate a radio frequency (RF) signal in a defined polarization (e.g., linear polarization or circular polarization). The radiating structure is conductively coupled to a first pair of feed ports and a second pair of feed ports. In examples discussed herein, at least one selected pair of feed ports among the first pair of feed ports and the second pair of feed ports can be dynamically configured to receive a differential signal(s). By applying the differential signal(s) to the selected pair of feed ports with a proper polarity and/or a relative phase differential, it may be possible to cause the radiating structure to radiate in the defined polarization without requiring additional circuitries (e.g., switching circuit), thus helping to reduce power consumption, heat dissipation, and/or footprint in an apparatus employing the antenna element.

Abstract: Embodiments of the disclosure relate to a three-dimensional (3D) integrated circuit (IC) (3DIC) assembly with active interposer. The 3DIC assembly includes an antenna substrate having at least one electromagnetic radiating structure (e.g., an antenna) and a carrier substrate having layered conductive interconnects. An active interposer(s) is formed by a semiconductor IC chip(s) and disposed between the antenna substrate and the carrier substrate to conductively couple the antenna substrate with the carrier substrate. The active interposer is coupled to the electromagnetic radiating structure in the antenna substrate through a conductive path that penetrates the antenna substrate, but not going through the carrier substrate. As such, it is possible to reduce routing distance between the active interposer and the electromagnetic radiating structure, thus helping to reduce path loss and/or electromagnetic signal interference to improve heat dissipation and power consumption of the 3DIC assembly.