Patents by Inventor Wolfram Ebert

Wolfram Ebert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4953834
    Abstract: A micromechanical bending spring joint is formed of selectively etched wafer material. The joint includes a pair of leaf springs arranged alongside each other. Each spring is inclined at an oblique angle to the opposed surfaces of the wafer and such springs cross to define a point of intersection. The joint, selectively etched from a single wafer, is characterized by high precision of fulcrum position, bending spring constant and transverse axis rigidity.
    Type: Grant
    Filed: January 20, 1988
    Date of Patent: September 4, 1990
    Assignee: Litef GmbH
    Inventors: Wolfram Ebert, Eberhard Handrich, Martin Hafen, Bruno Ryrko