Patents by Inventor Wolfram Eurskens

Wolfram Eurskens has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7602614
    Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
    Type: Grant
    Filed: June 4, 2004
    Date of Patent: October 13, 2009
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerler, Heinz Pape, Peter Strobel, Stephan Stoeckl
  • Patent number: 7276785
    Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
    Type: Grant
    Filed: September 7, 2004
    Date of Patent: October 2, 2007
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel
  • Publication number: 20060250781
    Abstract: An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
    Type: Application
    Filed: June 4, 2004
    Publication date: November 9, 2006
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Michael Bauer, Wolfram Eurskens, Rudolf Kerter, Heinz Pape, Peter Strobe, Stephan Stoeckl
  • Publication number: 20050052830
    Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
    Type: Application
    Filed: September 7, 2004
    Publication date: March 10, 2005
    Inventors: Michael Bauer, Wolfram Eurskens, Gerold Gruendler, Rudolf Kerler, Heinz Pape, Peter Strobel